Inventor · disambiguated record
Na-Ein Lee
Also filed as: LEE NA EIN
3 granted patents·8 citations·filing 2016–2017
60Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0193US10639875B2Wafer bonding apparatus and wafer bonding system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 5, 2020·6 cites·20 claims
- 0275US9812353B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·2 cites·20 claims
- 0354US9984921B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 29, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →