Inventor · disambiguated record
Nancy M. Lomeli
Also filed as: LOMELI NANCY · LOMELI NANCY M
58 granted patents·25 pending applications·87 citations·filing 2017–2025
97Inventor score
Top patents by PatentIndex Score
83 records- 0198US11251190B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 15, 2022·9 cites·26 claims
- 0298US10446578B1Methods used in forming an array of elevationally-extending strings of memory cells, methods of forming an array of elevationally-extending strings of memory cells, and methods of forming an array of vertical strings of memory cellsMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 15, 2019·36 cites·27 claims
- 0396US11393835B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 19, 2022·4 cites·31 claims
- 0495US10553607B1Method of forming an array of elevationally-extending strings of programmable memory cells and method of forming an array of elevationally-extending strings of memory cellsMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 4, 2020·13 cites·26 claims
- 0594US11690234B2Microelectronic devices and related methods of forming microelectronic devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 27, 2023·2 cites·20 claims
- 0693US11282747B2Methods of forming microelectronic devices, and related microelectronic devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 22, 2022·3 cites·14 claims
- 0792US11398486B2Microelectronic devices with tier stacks with varied tier thicknesses, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 26, 2022·2 cites·21 claims
- 0891US10446566B2Integrated assemblies having anchoring structures proximate stacked memory cellsMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 15, 2019·8 cites·12 claims
- 0989US12432925B2Integrated assemblies which include stacked memory decks, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 1088US11715685B2Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 1, 2023·2 cites·17 claims
- 1187US2025275142A1Microelectronic and electronic devices with shouldered pillars or openings extending through a tiered stack, and related methodsLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 1285US12302571B2Microelectronic devices with pillars or openings extending through a tiered stackLODESTAR LICENSING GROUP LLC·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1384US11049768B2Methods of forming microelectronic devices, and related microelectronic devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 29, 2021·4 cites·19 claims
- 1483US12010850B2Integrated assemblies which include stacked memory decks, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 1583US2025267872A1Memory devices including staircase structuresLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 1683US2025063733A1Memory devices including different tier pitchesLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 1782US12426265B2Method used in forming a memory array comprising strings of memory cells using pillarsMICRON TECHNOLOGY INC·Filed 2024·Granted Sep 23, 2025·0 cites·14 claims
- 1882US11424262B2Microelectronic devices including staircase structures, and related memory devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 23, 2022·1 cites·23 claims
- 1981US12160993B2Memory devices including different tier pitches, and related electronic systemsLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Dec 3, 2024·0 cites·19 claims
- 2081US11706925B2Methods of forming electronic devices with channel openings or pillars extending through a tier stackMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 18, 2023·0 cites·20 claims
- 2180US11917817B2Microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 27, 2024·1 cites·16 claims
- 2278US12471295B2Microelectronic devices with tier stacks with varied tier thicknesses, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 2378US2024349498A1Microelectronic devices and memory devicesLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 2477US12317498B2Microelectronic devices including staircase structuresMICRON TECHNOLOGY INC·Filed 2022·Granted May 27, 2025·0 cites·19 claims
- 2577US12250812B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 2677US2025279142A1Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2777US2025261367A1Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2876US12041769B2Methods of forming microelectronic devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 2975US11751396B2Microelectronic devices including varying tier pitch, and related electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 5, 2023·0 cites·17 claims
- 3075US11744072B2Integrated assemblies which include stacked memory decksMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 29, 2023·0 cites·21 claims
- 3175US10903220B2Integrated assemblies having anchoring structures proximate stacked memory cells, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 26, 2021·1 cites·9 claims
- 3274US12225721B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 11, 2025·0 cites·15 claims
- 3374US2024244840A1Memory Array And Method Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3474US2025292836A1Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3573US12219757B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 4, 2025·0 cites·11 claims
- 3673US11956950B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 9, 2024·0 cites·16 claims
- 3773US2025194088A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3873US2023247828A1Memory Array And Method Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3971US11495617B2Electronic devices and systems with channel openings or pillars extending through a tier stack, and methods of formationMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 4071US2023171960A1Memory Array And Method Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 4170US12322443B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 3, 2025·0 cites·41 claims
- 4270US11956955B2Method used in forming a memory array comprising strings of memory cells in which liners are isotropically etchedMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 9, 2024·0 cites·17 claims
- 4370US11264404B2Microelectronic devices including a varying tier pitch, and related electronic systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 1, 2022·0 cites·24 claims
- 4470US2024215232A1Methods of forming microelectronic devicesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4569US11894269B2Integrated assemblies and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Feb 6, 2024·0 cites·18 claims
- 4669US11889696B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 30, 2024·0 cites·22 claims
- 4769US11659708B2Memory array and method used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·0 cites·16 claims
- 4869US11515320B2Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 29, 2022·0 cites·11 claims
- 4968US11348933B2Integrated assemblies having anchoring structures proximate stacked memory cells, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 5067US12295140B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted May 6, 2025·0 cites·14 claims
Showing the top 50 of 83 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →