Inventor · disambiguated record
Nanako Maeda
Also filed as: MAEDA NANAKO
3 granted patents·1 citations·filing 2013–2021
48Inventor score
Technology areasH10W
Files withTANAKA ELECTRONICS IND3
Top patents by PatentIndex Score
3 records- 0160US11996382B2Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereofTANAKA ELECTRONICS IND·Filed 2021·Granted May 28, 2024·0 cites·15 claims
- 0255US9972595B2Bonding wire for high-speed signal lineTANAKA ELECTRONICS IND·Filed 2013·Granted May 15, 2018·1 cites·9 claims
- 0337US9362249B2Silver—gold alloy bonding wireTANAKA ELECTRONICS IND·Filed 2015·Granted Jun 7, 2016·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →