Inventor · disambiguated record
Naohiro Mashino
Also filed as: MASHINO NAOHIRO
27 granted patents·8 pending applications·1,015 citations·filing 1996–2024
97Inventor score
Top patents by PatentIndex Score
35 records- 0198US6703310B2Semiconductor device and method of production of sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Mar 9, 2004·211 cites·7 claims
- 0296US6699787B2Semiconductor device and method of production of sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Mar 2, 2004·119 cites·12 claims
- 0395US7217888B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2003·Granted May 15, 2007·79 cites·6 claims
- 0493US5886759ALiquid crystal display device having a side edge type back light system with a hue layer in the vicinity of the light sourceHITACHI LTD·Filed 1996·Granted Mar 23, 1999·152 cites·10 claims
- 0592US7936568B2Capacitor built-in substrate and method of manufacturing the same and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted May 3, 2011·24 cites·3 claims
- 0691US6943442B2Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating filmSHINKO ELECTRIC IND CO·Filed 2003·Granted Sep 13, 2005·45 cites·7 claims
- 0790US6545353B2Multilayer wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2001·Granted Apr 8, 2003·59 cites·6 claims
- 0890US6507497B2Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposerSHINKO ELECTRIC IND CO·Filed 2001·Granted Jan 14, 2003·61 cites·11 claims
- 0989US6670269B2Method of forming through-hole or recess in silicon substrateSHINKO ELECTRIC IND CO·Filed 2002·Granted Dec 30, 2003·55 cites·13 claims
- 1089US6548891B2Semiconductor device and production process thereofSHINKO ELECTRIC IND CO·Filed 2001·Granted Apr 15, 2003·55 cites·12 claims
- 1188US7655504B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Feb 2, 2010·15 cites·8 claims
- 1286US7755910B2Capacitor built-in interposer and method of manufacturing the same and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Jul 13, 2010·13 cites·5 claims
- 1384US6815348B2Method of plugging through-holes in silicon substrateSHINKO ELECTRIC IND CO·Filed 2003·Granted Nov 9, 2004·30 cites·7 claims
- 1482US7114251B2Method of producing of circuit board; for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2002·Granted Oct 3, 2006·27 cites·7 claims
- 1581US7909976B2Method for filling through holeSHINKO ELECTRIC IND CO·Filed 2006·Granted Mar 22, 2011·9 cites·11 claims
- 1680US8004382B2Inductor device, and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2010·Granted Aug 23, 2011·4 cites·8 claims
- 1773US8179689B2Printed circuit board, method of fabricating printed circuit board, and semiconductor deviceMASHINO NAOHIRO·Filed 2009·Granted May 15, 2012·7 cites·13 claims
- 1872US7929320B2Inductor built-in wiring board having shield functionSHINKO ELECTRIC IND CO·Filed 2008·Granted Apr 19, 2011·4 cites·8 claims
- 1969US7530163B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted May 12, 2009·4 cites·5 claims
- 2068US6872634B2Method of manufacturing micro-semiconductor elementSHINKO ELECTRIC IND CO·Filed 2003·Granted Mar 29, 2005·11 cites·4 claims
- 2166US7205230B2Process for manufacturing a wiring board having a viaSHINKO ELECTRIC IND CO·Filed 2004·Granted Apr 17, 2007·11 cites·8 claims
- 2266US6661077B2Semiconductor device including primary connecting plug and an auxiliary connecting plugSHINKO ELECTRIC IND CO·Filed 2002·Granted Dec 9, 2003·13 cites·2 claims
- 2364US11659667B2Wiring board and method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2021·Granted May 23, 2023·0 cites·8 claims
- 2462US8007649B2Hydrophilic treatment method and wiring pattern forming methodSHINKO ELECTRIC IND CO·Filed 2005·Granted Aug 30, 2011·1 cites·14 claims
- 2560US2024276653A1Wiring board and wiring board manufacturing methodSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 2659US2024047329A1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2023·Application pending·0 cites
- 2756US8101461B2Stacked semiconductor device and method of manufacturing the sameTAKANO AKIHITO·Filed 2009·Granted Jan 24, 2012·1 cites·11 claims
- 2855US7084009B2Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrateSHINKO ELECTRIC IND CO·Filed 2004·Granted Aug 1, 2006·4 cites·8 claims
- 2947US2009243035A1Semiconductor device and method of manufacturing the same and semiconductor device mounting structureSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 3043US6433415B2Assembly of plurality of semiconductor devicesSHINKO ELECTRIC IND CO·Filed 2001·Granted Aug 13, 2002·1 cites·12 claims
- 3141US2008164967A1Inductance elementMASHINO NAOHIRO·Filed 2007·Application pending·0 cites
- 3240US2003232486A1Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2003·Application pending·0 cites
- 3340US2003230797A1Semiconductor module structure incorporating antennaSHINKO ELECTRIC IND CO·Filed 2003·Application pending·0 cites
- 3439US2003232580A1Method of machining silicon waferSHINKO ELECTRIC IND CO·Filed 2003·Application pending·0 cites
- 3532US2003086248A1Interposer for semiconductor, method for manufacturing same, and semiconductor device using sameMASHINO NAOHIRO·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →