Inventor · disambiguated record
Naoaki Mihara
Also filed as: MIHARA NAOAKI
11 granted patents·5 pending applications·10 citations·filing 2014–2018
82Inventor score
Files withFURUKAWA ELECTRIC CO LTD16
Top patents by PatentIndex Score
16 records- 0184US10689550B2Electrically conductive compositionFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Jun 23, 2020·5 cites·13 claims
- 0278US10084153B2Filler material for organic electroluminescent element and method of sealing organic electroluminiscent elementFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Sep 25, 2018·1 cites·8 claims
- 0375US9913324B2Resin composition for sealing organic electroluminescent element, sealing film for organic electroluminescent element, gas-barrier film for organic electroluminescent element, and organic electroluminescent element using these filmsFURUKAWA ELECTRIC CO LTD·Filed 2014·Granted Mar 6, 2018·1 cites·10 claims
- 0474US9758690B2Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying imageFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Sep 12, 2017·1 cites·8 claims
- 0566US11066577B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Jul 20, 2021·1 cites·13 claims
- 0664US11230649B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Jan 25, 2022·1 cites·12 claims
- 0749US2018294242A1Electrically conductive adhesive film and dicing die bonding filmFURUKAWA ELECTRIC CO LTD·Filed 2018·Application pending·0 cites
- 0847US9793511B2Filler material for organic electroluminescent element and method of sealing organic electroluminescent elementFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Oct 17, 2017·0 cites·20 claims
- 0945US10043996B2Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display deviceFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·17 claims
- 1044US2018026003A1Electrically conductive adhesive film and dicing die bonding filmFURUKAWA ELECTRIC CO LTD·Filed 2016·Application pending·0 cites
- 1143US11136479B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Oct 5, 2021·0 cites·11 claims
- 1242US11306225B2Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Apr 19, 2022·0 cites·12 claims
- 1341US11193047B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Dec 7, 2021·0 cites·11 claims
- 1438US2016020423A1Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display deviceFURUKAWA ELECTRIC CO LTD·Filed 2015·Application pending·0 cites
- 1534US2017152411A1Conductive adhesive filmFURUKAWA ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
- 1632US2016017186A1Sealant composition and sealing sheet obtained from the compositionFURUKAWA ELECTRIC CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →