Inventor · disambiguated record
Naoaki Nakamura
Also filed as: NAKAMURA NAOAKI
17 granted patents·10 pending applications·54 citations·filing 2000–2020
90Inventor score
Top patents by PatentIndex Score
27 records- 0190US10443957B2Cooling plate and information processing deviceFUJITSU LTD·Filed 2018·Granted Oct 15, 2019·7 cites·10 claims
- 0286US9642287B2Cooling plate and data processing system provided with cooling platesFUJITSU LTD·Filed 2016·Granted May 2, 2017·3 cites·13 claims
- 0384US10103510B2Optical module and method of manufacturing optical moduleFUJITSU LTD·Filed 2017·Granted Oct 16, 2018·4 cites·4 claims
- 0480US9817453B2Cooling device and electronic apparatusFUJITSU LTD·Filed 2015·Granted Nov 14, 2017·4 cites·14 claims
- 0579US10629556B2Composite bump, method for forming composite bump, and substrateFUJITSU LTD·Filed 2018·Granted Apr 21, 2020·2 cites·11 claims
- 0677US7880485B2High-sensitive resistance measuring device and monitoring method of solder bumpFUJITSU LTD·Filed 2008·Granted Feb 1, 2011·8 cites·23 claims
- 0770US10591690B2Optical module and method of manufacturing the sameFUJITSU LTD·Filed 2018·Granted Mar 17, 2020·1 cites·8 claims
- 0868US10261249B2Optical module and method of manufacturing optical moduleFUJITSU LTD·Filed 2017·Granted Apr 16, 2019·1 cites·7 claims
- 0967US6396701B1Semiconductor unit and cooling deviceFUJITSU LTD·Filed 2000·Granted May 28, 2002·14 cites·10 claims
- 1060US6971571B2Reflow soldering apparatus and reflow soldering methodFUJITSU LTD·Filed 2003·Granted Dec 6, 2005·10 cites·10 claims
- 1157US10996403B2Optical fiber mounting method and optical moduleFUJITSU LTD·Filed 2020·Granted May 4, 2021·0 cites·5 claims
- 1254US10586770B2Optical moduleFUJITSU LTD·Filed 2018·Granted Mar 10, 2020·0 cites·10 claims
- 1354US10444450B2Optical moduleFUJITSU LTD·Filed 2018·Granted Oct 15, 2019·0 cites·9 claims
- 1452US2015123259A1Thermal interface sheet and processorFUJITSU LTD·Filed 2014·Application pending·0 cites
- 1551US2007012477A1Electronic component package including joint material having higher heat conductivityFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1650US9704775B2Method for manufacturing thermal interface sheetFUJITSU LTD·Filed 2016·Granted Jul 11, 2017·0 cites·4 claims
- 1748US9230964B2Stacked three dimensional semiconductor device with in-circuit antennaFUJITSU LTD·Filed 2014·Granted Jan 5, 2016·0 cites·3 claims
- 1842US2008006915A1Semiconductor package, method of production of same, printed circuit board, and electronic apparatusFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1942US2019274216A1Board module and method of manufacturing board moduleFUJITSU LTD·Filed 2019·Application pending·0 cites
- 2040US10115694B2Electronic device, electronic device fabrication method, and electronic apparatusFUJITSU LTD·Filed 2016·Granted Oct 30, 2018·0 cites·7 claims
- 2140US2006169591A1Method of making printed wiring board and method of forming plating filmFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2239US9117788B2Heat sink device and method of repairing semiconductor deviceYAMAMOTO TSUYOSHI·Filed 2011·Granted Aug 25, 2015·0 cites·1 claims
- 2338US2018217343A1Optical moduleFUJITSU LTD·Filed 2018·Application pending·0 cites
- 2438US2013083504A1Electronic deviceFUKUZONO KENJI·Filed 2012·Application pending·0 cites
- 2537US2017186719A1Semiconductor device, method of manufacturing same, and electronic apparatusFUJITSU LTD·Filed 2016·Application pending·0 cites
- 2637US2012083151A1Method of detachment of connector, connector detachment tool, and connectorTAKADA RIE·Filed 2011·Application pending·0 cites
- 2735US2017084581A1Laminated chip, laminated-chip-mounted substrate and manufacturing method of laminated chipFUJITSU LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →