Inventor · disambiguated record
Naoki Noda
Also filed as: NODA NAOKI
7 granted patents·4 pending applications·953 citations·filing 1987–2013
85Inventor score
Files withNODA NAOKI4CENTRAL RES INST ELECT1CHISSO CORP1MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1NIPPON INSTR CORP1
Top patents by PatentIndex Score
11 records- 0194US5750753AMethod for manufacturing acryloxypropysilaneCHISSO CORP·Filed 1996·Granted May 12, 1998·911 cites·2 claims
- 0261US8592285B2Method of bonding semiconductor substrate and MEMS deviceNODA NAOKI·Filed 2009·Granted Nov 26, 2013·2 cites·19 claims
- 0360US6750642B2Power conserving regulator having intermittently connectable controllerPIONEER TOHOKU CORP·Filed 2002·Granted Jun 15, 2004·17 cites·17 claims
- 0460US4710608AFixture for welding long workpiecesTOYOTA MOTOR CO LTD·Filed 1987·Granted Dec 1, 1987·17 cites·16 claims
- 0558US7144736B2Method and apparatus for continuous fractional analysis of metallic mercury and water-soluble mercury in a gasNIPPON INSTR CORP·Filed 2001·Granted Dec 5, 2006·5 cites·4 claims
- 0654US8896132B2Electronic device and fabrication method thereofNODA NAOKI·Filed 2010·Granted Nov 25, 2014·1 cites·7 claims
- 0744US9443831B2Substrate for mounting LED element, LED light source and LED displayNORITAKE CO LTD·Filed 2013·Granted Sep 13, 2016·0 cites·5 claims
- 0841US2007069235A1Light-emitting elementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 0939US2012299128A1Method of bonding semiconductor substrate and mems deviceNODA NAOKI·Filed 2009·Application pending·0 cites
- 1039US2012319220A1Method of bonding semiconductor substrate and mems deviceNODA NAOKI·Filed 2009·Application pending·0 cites
- 1139US2004237634A1Method of and apparatus for measuring mercury contained in gaseous mediumCENTRAL RES INST ELECT·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →