Inventor · disambiguated record
Natsumi Okawa
Also filed as: OKAWA NATSUMI
1 granted patent·3 pending applications·0 citations·filing 2020–2023
10Inventor score
Files withTOKYO OHKA KOGYO CO LTD4
Top patents by PatentIndex Score
4 records- 0160US2023265362A1Rinsing solution, method of treating substrate, and method of manufacturing semiconductor deviceTOKYO OHKA KOGYO CO LTD·Filed 2023·Application pending·0 cites
- 0256US11686002B2Method for manufacturing ruthenium wiringTOKYO OHKA KOGYO CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·7 claims
- 0352US2022017455A1Surface treatment agent, surface treatment method, and region selective film formation method for surface of substrateTOKYO OHKA KOGYO CO LTD·Filed 2021·Application pending·0 cites
- 0443US2021171549A1Surface treatment agent and surface treatment methodTOKYO OHKA KOGYO CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →