Inventor · disambiguated record
Navas Khan Oratti Kalandar
Also filed as: ORATTI KALANDAR NAVAS KHAN
7 granted patents·7 pending applications·10 citations·filing 2007–2020
73Inventor score
Files withFREESCALE SEMICONDUCTOR INC7NXP USA INC3AGENCY SCIENCE TECH & RES1INFINEON TECHNOLOGIES AG1KRIPESH VAIDYANATHAN1
Top patents by PatentIndex Score
14 records- 0188US9953904B1Electronic component package with heatsink and multiple electronic componentsFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Apr 24, 2018·9 cites·20 claims
- 0259US9508632B1Apparatus and methods for stackable packagingFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Nov 29, 2016·1 cites·16 claims
- 0352US2011316117A1Die package and a method for manufacturing the die packageKRIPESH VAIDYANATHAN·Filed 2008·Application pending·0 cites
- 0447US11152321B2Semiconductor device having a copper pillar interconnect structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 19, 2021·0 cites·17 claims
- 0544US10431534B2Package with support structureNXP USA INC·Filed 2018·Granted Oct 1, 2019·0 cites·20 claims
- 0643US2017278825A1Apparatus and Methods for Multi-Die PackagingFREESCALE SEMICONDUCTOR INC·Filed 2016·Application pending·0 cites
- 0740US9947614B2Packaged semiconductor device having bent leads and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Apr 17, 2018·0 cites·12 claims
- 0840US2010187682A1Electronic package and method of assembling the samePINJALA DAMARUGANATH·Filed 2007·Application pending·0 cites
- 0939US9691637B2Method for packaging an integrated circuit device with stress bufferFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 27, 2017·0 cites·20 claims
- 1035US2019103365A1Selectively shielded semiconductor packageNXP USA INC·Filed 2017·Application pending·0 cites
- 1135US2019157222A1Package with isolation structureNXP USA INC·Filed 2017·Application pending·0 cites
- 1234US10147645B2Wafer level chip scale package with encapsulantFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Dec 4, 2018·0 cites·17 claims
- 1334US2013001795A1Wafer Level Package and a Method of Forming the SameAGENCY SCIENCE TECH & RES·Filed 2012·Application pending·0 cites
- 1433US2018053753A1Stackable molded packages and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →