Inventor · disambiguated record
Namwoong Paik
Also filed as: PAIK NAMWOONG
9 granted patents·8 pending applications·6 citations·filing 2002–2025
79Inventor score
Top patents by PatentIndex Score
17 records- 0192US10957733B2Interconnect bump structures for photo detectorsSENSORS UNLIMITED INC·Filed 2020·Granted Mar 23, 2021·3 cites·11 claims
- 0276US10727267B2Interconnect bump structures for photo detectorsSENSORS UNLIMITED INC·Filed 2018·Granted Jul 28, 2020·2 cites·9 claims
- 0369US10566371B2Bump structures for interconnecting focal plane arraysSENSORS UNLIMITED INC·Filed 2018·Granted Feb 18, 2020·1 cites·6 claims
- 0463US12446340B2Sensor with upconversion layerSTANFORD RES INST INT·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 0563US2025198835A1Laser detection using multiple image sensorsSTANFORD RES INST INT·Filed 2024·Application pending·0 cites
- 0662US10879204B2Bump structures for high density flip chip interconnectionSENSORS UNLIMITED INC·Filed 2020·Granted Dec 29, 2020·0 cites·14 claims
- 0762US2025071397A1Measurement of a laser pulse repetition frequency using upconversionSTANFORD RES INST INT·Filed 2024·Application pending·0 cites
- 0859US2025305872A1Upconverting image sensor with pump sourceSTANFORD RES INST INT·Filed 2025·Application pending·0 cites
- 0956US10622324B2Bump structures for high density flip chip interconnectionSENSORS UNLIMITED INC·Filed 2018·Granted Apr 14, 2020·0 cites·7 claims
- 1054US2011070666A1Deposition methodPAIK NAMWOONG·Filed 2009·Application pending·0 cites
- 1154US2025040265A1Broadband silicon sensorSTANFORD RES INST INT·Filed 2022·Application pending·0 cites
- 1250US12464260B2Time centered high-dynamic-range readoutMCCARTEN JOHN P·Filed 2022·Granted Nov 4, 2025·0 cites·18 claims
- 1349US10468437B2Mesas and implants in two-dimensional arraysSENSORS UNLIMITED INC·Filed 2018·Granted Nov 5, 2019·0 cites·20 claims
- 1447US10096639B2Bump structures for interconnecting focal plane arraysSENSORS UNLIMITED INC·Filed 2016·Granted Oct 9, 2018·0 cites·6 claims
- 1541US2004129557A1Method of forming non-oxide thin films using negative sputter ion beam sourcePLASMION CORP·Filed 2003·Application pending·0 cites
- 1640US2020052012A1Mesa trench etch with stacked sidewall passivationSENSORS UNLIMITED INC·Filed 2018·Application pending·0 cites
- 1739US2004099525A1Method of forming oxide thin films using negative sputter ion beam sourcePLASMION CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →