Inventor · disambiguated record
Naoyoshi Sato
Also filed as: SATO NAOYOSHI
16 granted patents·3 pending applications·89 citations·filing 1998–2023
91Inventor score
Top patents by PatentIndex Score
19 records- 0165US12435236B2Coating liquid, composite material, and coating filmSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Oct 7, 2025·0 cites·2 claims
- 0264US8038808B2Flat soft magnetic material and process for its productionTDK CORP·Filed 2009·Granted Oct 18, 2011·2 cites·4 claims
- 0364US6217978B1Incombustible honeycomb radio absorptive material and radio absorber using the sameTDK CORP·Filed 1999·Granted Apr 17, 2001·24 cites·22 claims
- 0459US12331195B2Composite material, sheet, and heat insulatorSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 17, 2025·0 cites·11 claims
- 0559US12110414B2Method for suppressing corrosion under heat-insulating material, and paste for suppressing corrosion under heat-insulating materialRESONAC CORP·Filed 2018·Granted Oct 8, 2024·0 cites·12 claims
- 0658US12324105B2Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Granted Jun 3, 2025·0 cites·15 claims
- 0758US6402979B1Magnetic ferrite material and manufacture method thereofTDK CORP·Filed 2000·Granted Jun 11, 2002·6 cites·6 claims
- 0857US6033594AFerrite and inductorTDK CORP·Filed 1998·Granted Mar 7, 2000·15 cites·12 claims
- 0956US6933799B1Method of controlling intermodulation distortion of non-reciprocal deviceTDK CORP·Filed 2000·Granted Aug 23, 2005·6 cites·26 claims
- 1052US12024624B2Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Granted Jul 2, 2024·0 cites·13 claims
- 1150US2025188263A1Resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 1246US6077453AFerrite, and transformer and method for driving itTDK CORP·Filed 1999·Granted Jun 20, 2000·9 cites·11 claims
- 1345US2023391940A1Maleimide resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Application pending·0 cites
- 1444US2021277261A1Method for producing coating liquid, coating liquid, and coating filmSHOWA DENKO MATERIALS CO LTD·Filed 2018·Application pending·0 cites
- 1539US6210597B1Radio wave absorbentTDK CORP·Filed 1998·Granted Apr 3, 2001·7 cites·4 claims
- 1638US6259394B1Electric wave absorberTDK CORP·Filed 1999·Granted Jul 10, 2001·10 cites·26 claims
- 1736US6200493B1MnMgCuZn ferrite materialTDK CORP·Filed 1999·Granted Mar 13, 2001·4 cites·14 claims
- 1834US6113843AProcess for preparation of oxide magnetic compactTDK CORP·Filed 1999·Granted Sep 5, 2000·3 cites·4 claims
- 1932US6344255B1Radio wave transmitting materialTDK CORP·Filed 1999·Granted Feb 5, 2002·3 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →