Inventor · disambiguated record
Naoji Senba
Also filed as: SENBA NAOJI
22 granted patents·5 pending applications·1,479 citations·filing 1992–2002
97Inventor score
Top patents by PatentIndex Score
27 records- 0194US6188127B1Semiconductor packing stack module and method of producing the sameNEC CORP·Filed 1996·Granted Feb 13, 2001·226 cites·12 claims
- 0294US6114864AProbe card with plural probe tips on a unitary flexible tongueNEC CORP·Filed 1997·Granted Sep 5, 2000·152 cites·29 claims
- 0393US5883426AStack moduleNEC CORP·Filed 1997·Granted Mar 16, 1999·410 cites·7 claims
- 0490US5973392AStacked carrier three-dimensional memory module and semiconductor device using the sameNEC CORP·Filed 1998·Granted Oct 26, 1999·154 cites·16 claims
- 0590US5600180ASealing structure for bumps on a semiconductor integrated circuit chipNEC CORP·Filed 1995·Granted Feb 4, 1997·129 cites·30 claims
- 0689US6307392B1Probe card and method of forming a probe cardNEC CORP·Filed 1998·Granted Oct 23, 2001·96 cites·32 claims
- 0783US6576499B2Electronic device assembly and a method of connecting electronic devices constituting the sameNEC CORP·Filed 2001·Granted Jun 10, 2003·25 cites·3 claims
- 0881US6798070B2Electronic device assembly and a method of connecting electronic devices constituting the sameNEC CORP·Filed 2000·Granted Sep 28, 2004·23 cites·8 claims
- 0979US5793117ASemiconductor device and method of fabricating the sameNEC CORP·Filed 1996·Granted Aug 11, 1998·58 cites·25 claims
- 1071US6095398ASolder ball arrangement deviceNEC CORP·Filed 1998·Granted Aug 1, 2000·25 cites·14 claims
- 1170US6307159B1Bump structure and method for making the sameNEC CORP·Filed 1998·Granted Oct 23, 2001·32 cites·85 claims
- 1270US5976965AMethod for arranging minute metallic ballsNEC CORP·Filed 1998·Granted Nov 2, 1999·35 cites·7 claims
- 1369US6422452B2Method and apparatus for lining up micro-ballsJAPAN EM KK·Filed 2001·Granted Jul 23, 2002·15 cites·11 claims
- 1467US5310965AMulti-level wiring structure having an organic interlayer insulating filmNEC CORP·Filed 1992·Granted May 10, 1994·39 cites·24 claims
- 1556US6313533B1Function element, substrate for mounting function element thereon, and method of connecting them to each otherNEC CORP·Filed 1999·Granted Nov 6, 2001·22 cites·19 claims
- 1655US6486540B2Three-dimensional semiconductor device and method of manufacturing the sameNEC CORP·Filed 2001·Granted Nov 26, 2002·6 cites·28 claims
- 1752US6378756B1Solder ball arrangement deviceNEC CORP·Filed 2000·Granted Apr 30, 2002·3 cites·4 claims
- 1847US6625883B2Method for making a bump structureNEC CORP·Filed 2001·Granted Sep 30, 2003·2 cites·12 claims
- 1946US5936845AIC package and IC probe card with organic substrateNEC CORP·Filed 1997·Granted Aug 10, 1999·13 cites·16 claims
- 2037US6096259AFabrication method of plastic-molded lead componentNEC CORP·Filed 1997·Granted Aug 1, 2000·6 cites·9 claims
- 2137US2003085256A1Semiconductor manufacturing apparatus and method, semiconductor device and electronic deviceSENBA NAOJI·Filed 2002·Application pending·0 cites
- 2237US2003127724A1Double side connected type semiconductor apparatusNEC ELECTRONICS CORP·Filed 2002·Application pending·0 cites
- 2336US6191482B1Semiconductor chip carrier having partially buried conductive pattern and semiconductor device using the sameNEC CORP·Filed 1998·Granted Feb 20, 2001·6 cites·18 claims
- 2436US2001054762A1Semiconductor device and method of fabricating the sameNEC CORP·Filed 2001·Application pending·0 cites
- 2536US2002056922A1Semiconductor device, production method thereof, and coil spring cutting jig and coil spring guiding jig applied theretoNEC CORP·Filed 2001·Application pending·0 cites
- 2633US2001015372A1Apparatus for transferring micro-ballsE M CO LTD·Filed 2000·Application pending·0 cites
- 2731US6194787B1Multistage coupling semiconductor carrier, semiconductor device using the semiconductor carrierNEC CORP·Filed 1997·Granted Feb 27, 2001·2 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →