Inventor · disambiguated record
Narae Shin
Also filed as: SHIN NARAE
1 granted patent·12 pending applications·0 citations·filing 2014–2025
9Inventor score
Files withSAMSUNG ELECTRONICS CO LTD13
Top patents by PatentIndex Score
13 records- 0155US2025062211A1Driving circuit mounting filmSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0254US2025087562A1Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0354US2025329619A1Semiconductor package and package module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0452US2024321902A1Chip-on-film package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0552US2024413071A1Semiconductor package and package module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0649US9313889B2Display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 12, 2016·0 cites·17 claims
- 0749US2024234277A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0845US2024088003A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0944US2023420349A1Semiconductor package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1042US2024321712A1Chip-on-film packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1140US2025386653A1Display device including display moduleSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1237US2023369265A1Film package and package module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1337US2015269911A1Chip on film packages including plurality of output pads connected to film wiresSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →