Inventor · disambiguated record
Naoto Sugai
Also filed as: SUGAI NAOTO
7 granted patents·5 pending applications·274 citations·filing 1999–2022
86Inventor score
Top patents by PatentIndex Score
12 records- 0191US6571312B1Data storage method and data processing device using an erasure block buffer and write buffer for writing and erasing data in memoryMITSUBISHI ELECTRIC CORP·Filed 2000·Granted May 27, 2003·85 cites·15 claims
- 0287US6795890B1Data storage method, and data processing device using an erasure block buffer and write buffer for writing and erasing data in memoryMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 21, 2004·60 cites·13 claims
- 0379US6374353B1Information processing apparatus method of booting information processing apparatus at a high speedMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 16, 2002·114 cites·12 claims
- 0478US7805555B2Multiprocessor systemRENESAS TECH CORP·Filed 2008·Granted Sep 28, 2010·11 cites·7 claims
- 0573US8051234B2Multiprocessor systemRENESAS ELECTRONICS CORP·Filed 2010·Granted Nov 1, 2011·4 cites·3 claims
- 0667US2025059346A1Polyamide compositionKURARAY CO·Filed 2022·Application pending·0 cites
- 0767US2025059326A1Polyamide compositionKURARAY CO·Filed 2022·Application pending·0 cites
- 0861US11970612B2Polyamide composition and molded product composed of said polyamide compositionKURARAY CO·Filed 2019·Granted Apr 30, 2024·0 cites·10 claims
- 0959US11969924B2Waterproof component and electronic equipment provided with same, method for waterproofing insert molded body, and method for waterproofing electronic equipmentKURARAY CO·Filed 2018·Granted Apr 30, 2024·0 cites·16 claims
- 1058US2023151152A1Colored polyamide resin composition and molded body thereofKURARAY CO·Filed 2021·Application pending·0 cites
- 1151US2022056268A1Waterproof component, electronic equipment comprising same, waterproofing method using insert-molded body, and waterproofing method for electronic equipmentKURARAY CO·Filed 2020·Application pending·0 cites
- 1244US2022177700A1Waterproof component, electronic equipment comprising same, waterproofing method using insert-molded body, and waterproofing method for electronic equipmentKURARAY CO·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →