Inventor · disambiguated record
Naokatsu Suwanai
Also filed as: SUWANAI NAOKATSU
11 granted patents·1 pending application·306 citations·filing 1989–2009
93Inventor score
Top patents by PatentIndex Score
12 records- 0190US5237187ASemiconductor memory circuit device and method for fabricating sameHITACHI LTD·Filed 1991·Granted Aug 17, 1993·66 cites·10 claims
- 0283US7705462B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2009·Granted Apr 27, 2010·8 cites·10 claims
- 0383US7615848B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Nov 10, 2009·8 cites·17 claims
- 0483US6043118ASemiconductor memory circuit device and method for fabricating a semiconductor memory device circuitHITACHI LTD·Filed 1997·Granted Mar 28, 2000·43 cites·21 claims
- 0583US5994762ASemiconductor integrated circuit device including boron-doped phospho silicate glass layer and manufacturing method thereofHITACHI LTD·Filed 1996·Granted Nov 30, 1999·77 cites·44 claims
- 0680US7400046B2Semiconductor device with guard rings that are formed in each of the plural wiring layersRENESAS TECH CORP·Filed 2007·Granted Jul 15, 2008·6 cites·22 claims
- 0779US7303986B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Dec 4, 2007·6 cites·22 claims
- 0879US5389558AMethod of making a semiconductor memory circuit deviceHITACHI LTD·Filed 1993·Granted Feb 14, 1995·35 cites·20 claims
- 0967US5025741AMethod of making semiconductor integrated circuit device with polysilicon contactsHITACHI LTD·Filed 1989·Granted Jun 25, 1991·33 cites·30 claims
- 1066US7189637B2Method of manufacturing a semiconductor device having a multi-layered wiring structureHITACHI ULSI SYS CO LTD·Filed 2003·Granted Mar 13, 2007·9 cites·29 claims
- 1161US5631182AMethod of making a semiconductor memory circuit deviceHITACHI LTD·Filed 1994·Granted May 20, 1997·15 cites·6 claims
- 1235US2002003305A1Semiconductor integrated circuit device including an interlayer insulating film formed under a bonding pad and arranged to prevent peeling of the bonding padFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →