Inventor · disambiguated record
Nagisa Suyama
Also filed as: SUYAMA NAGISA
0 granted patents·4 pending applications·0 citations·filing 2024–2025
Technology areasH10P
Files withKOKUSAI ELECTRIC CORP4
Top patents by PatentIndex Score
4 records- 0162US2025014891A1Method of processing substrate, method of manufacturing semiconductor device, recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0260US2024266164A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0359US2024425972A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0454US2025232975A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →