Inventor · disambiguated record
Nagamitsu Takashima
Also filed as: TAKASHIMA NAGAMITSU
30 granted patents·4 pending applications·230 citations·filing 1995–2013
96Inventor score
Top patents by PatentIndex Score
34 records- 0190US7610938B2Cylindrical rod and method for manufacturing the sameSEIKO EPSON CORP·Filed 2007·Granted Nov 3, 2009·30 cites·11 claims
- 0287US5872583AUsing fusible films having windows supplied with adhesive and gap materialSEIKO EPSON CORP·Filed 1995·Granted Feb 16, 1999·58 cites·17 claims
- 0386US7708390B2Method of working small recess portion, method of fabricating liquid ejection head and liquid ejection headSEIKO EPSON CORP·Filed 2008·Granted May 4, 2010·6 cites·5 claims
- 0483US7219983B2Fine forging method, manufacturing method of liquid ejection head, and liquid ejection headSEIKO EPSON CORP·Filed 2005·Granted May 22, 2007·6 cites·19 claims
- 0581US7543381B2Method of manufacturing a liquid ejecting headSEIKO EPSON CORP·Filed 2006·Granted Jun 9, 2009·6 cites·3 claims
- 0678US7575305B2Liquid ejection head having improved ejection performanceSEIKO EPSON CORP·Filed 2007·Granted Aug 18, 2009·4 cites·19 claims
- 0776US7546757B2Method of working small recess portionSEIKO EPSON CORP·Filed 2005·Granted Jun 16, 2009·3 cites·4 claims
- 0876US7194886B2Method for forging plate and method for manufacturing a liquid ejection headSEIKO EPSON CORP·Filed 2005·Granted Mar 27, 2007·4 cites·4 claims
- 0974US8613497B2Method of working small recess portion, method of fabricating liquid ejection head and liquid ejection headOGAWA HIDEYUKI·Filed 2010·Granted Dec 24, 2013·2 cites·13 claims
- 1074US7669329B2Apparatus of fabricating and method of fabricating liquid ejection head, and liquid ejection headSEIKO EPSON CORP·Filed 2008·Granted Mar 2, 2010·4 cites·1 claims
- 1172US7100415B2Method and apparatus for manufacturing a liquid ejection headSEIKO EPSON CORP·Filed 2004·Granted Sep 5, 2006·14 cites·20 claims
- 1272US6968723B2Method of punching small hole and method of manufacturing liquid ejection head using the sameSEIKO EPSON CORP·Filed 2003·Granted Nov 29, 2005·9 cites·32 claims
- 1369US7165433B2Method of manufacturing a chamber plate for a liquid ejection headSEIKO EPSON CORP·Filed 2003·Granted Jan 23, 2007·12 cites·10 claims
- 1469US6584687B1Method of manufacturing an ink-jet recording head using a thermally fusible film that does not close communication holesSEIKO EPSON CORP·Filed 1997·Granted Jul 1, 2003·23 cites·19 claims
- 1568US7480993B2Method of manufacturing a nozzle plateSEIKO EPSON CORP·Filed 2006·Granted Jan 27, 2009·2 cites·5 claims
- 1665US6968616B2Method of manufacturing nozzle plateSEIKO EPSON CORP·Filed 2002·Granted Nov 29, 2005·10 cites·10 claims
- 1763US7021749B2Liquid ejection head, and method of manufacturing the sameSEIKO EPSON CORP·Filed 2003·Granted Apr 4, 2006·9 cites·15 claims
- 1862US7040134B2Punch for forging a liquid ejection headSEIKO EPSON CORP·Filed 2003·Granted May 9, 2006·7 cites·12 claims
- 1961US8998387B2Method of working small recess portion, method of fabricating liquid ejection head and liquid ejection headSEIKO EPSON CORP·Filed 2013·Granted Apr 7, 2015·0 cites·15 claims
- 2060US7905431B2Forging punch, method of manufacturing liquid ejection head using the same, and liquid ejection head manufactured by the methodSEIKO EPSON CORP·Filed 2006·Granted Mar 15, 2011·2 cites·18 claims
- 2156US8439494B2Liquid ejecting head, method for making the same, and liquid ejecting apparatusOWAKI HIROSHIGE·Filed 2008·Granted May 14, 2013·1 cites·12 claims
- 2252US6997027B2Forging punchSEIKO EPSON CORP·Filed 2003·Granted Feb 14, 2006·4 cites·23 claims
- 2350US7249484B2Method for manufacturing a liquid ejection headSEIKO EPSON CORP·Filed 2004·Granted Jul 31, 2007·4 cites·8 claims
- 2450US7052119B2Liquid ejection head, and method of manufacturing the sameSEIKO EPSON CORP·Filed 2003·Granted May 30, 2006·4 cites·22 claims
- 2544US7703894B2Apparatus of fabricating and method of fabricating liquid ejection head, and liquid ejection headSEIKO EPSON CORP·Filed 2005·Granted Apr 27, 2010·0 cites·1 claims
- 2644US7363795B2Guided punching apparatusSEIKO EPSON CORP·Filed 2003·Granted Apr 29, 2008·2 cites·31 claims
- 2744US7127929B2Forging work methodSEIKO EPSON CORP·Filed 2003·Granted Oct 31, 2006·2 cites·19 claims
- 2844US2006042435A1Working method for forming minute holes, tool used in the method, method and apparatus for manufacturing liquid ejecting headSEIKO EPSON CORP·Filed 2005·Application pending·0 cites
- 2944US2009214388A1Method for manufacturing the scale, scale, and encoder-equipped apparatusSEIKO EPSON CORP·Filed 2009·Application pending·0 cites
- 3043US7254976B2Method of manufacturing liquid ejection headSEIKO EPSON CORP·Filed 2004·Granted Aug 14, 2007·2 cites·9 claims
- 3143US2006236536A1Die apparatus, method for producing perforated work plate, perforated work plate, liquid-jet head and liquid-jet apparatusSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 3242US7814640B2Manufacturing method of die for manufacturing liquid ejecting head, and material block used in the sameSEIKO EPSON CORP·Filed 2005·Granted Oct 19, 2010·0 cites·1 claims
- 3337US2004113979A1Nozzle plate for liquid drop spray head, method for manufacturing the same and a punchFiled 2002·Application pending·0 cites
- 3432US8187686B2Elastic member for ink jet recording apparatus, ink jet recording apparatus including elastic member, elastic member for ink tank and ink tank including elastic memberHORASAWA AKIO·Filed 2009·Granted May 29, 2012·0 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when Nagamitsu Takashima files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →