Inventor · disambiguated record
Naoya Take
Also filed as: TAKE NAOYA
19 granted patents·5 pending applications·48 citations·filing 2016–2023
91Inventor score
Top patents by PatentIndex Score
24 records- 0198US10505106B1Encapsulated PCM switching devices and methods of forming the sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Dec 10, 2019·20 cites·20 claims
- 0294US10515871B1Cooling devices having large surface area structures, systems incorporating the same, and methods of forming the sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Dec 24, 2019·7 cites·20 claims
- 0388US10830544B2Self-healing metal structuresTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Nov 10, 2020·5 cites·18 claims
- 0486US10490482B1Cooling devices including jet cooling with an intermediate mesh and methods for using the sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Nov 26, 2019·4 cites·20 claims
- 0581US10804236B2Power electronic assemblies with high purity aluminum plated substratesTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Oct 13, 2020·3 cites·20 claims
- 0681US10743442B2Cooling devices including jet cooling with an intermediate mesh and methods for using the sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Aug 11, 2020·3 cites·19 claims
- 0775US11101193B2Power electronics modules including integrated jet coolingTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Aug 24, 2021·2 cites·14 claims
- 0874US10727146B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2018·Granted Jul 28, 2020·3 cites·8 claims
- 0971US10700036B2Encapsulated stress mitigation layer and power electronic assemblies incorporating the sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Jun 30, 2020·1 cites·19 claims
- 1064US10879209B2Encapsulated stress mitigation layer and power electronic assemblies incorporating the sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2020·Granted Dec 29, 2020·0 cites·20 claims
- 1155US12436414B2Optical phase modulatorDENSO CORP·Filed 2023·Granted Oct 7, 2025·0 cites·7 claims
- 1254US2023138210A1Semiconductor deviceDENSO CORP·Filed 2022·Application pending·0 cites
- 1350US10896865B2Power electronics modules including an integrated cooling channel extending through an electrically-conductive substrateTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Jan 19, 2021·0 cites·15 claims
- 1448US11121061B2Cooling chip structures having a jet impingement system and assembly having the sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Sep 14, 2021·0 cites·20 claims
- 1548US10861816B2Electronic assemblies having a mesh bond material and methods of forming thereofTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Dec 8, 2020·0 cites·18 claims
- 1646US10903186B2Power electronic assemblies with solder layer and exterior coating, and methods of forming the sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2018·Granted Jan 26, 2021·0 cites·18 claims
- 1746US10818576B2Methods of forming power electronic assemblies using metal inverse opals and cap structuresTOYOTA ENG & MFG NORTH AMERICA·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 1846US10332852B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2018·Granted Jun 25, 2019·0 cites·5 claims
- 1942US2020245500A1Embedded cooling tubes, systems incorporating the same, and methods of forming the sameTOYOTA ENG & MFG NORTH AMERICA·Filed 2019·Application pending·0 cites
- 2039US10312211B2Method of manufacturing semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2016·Granted Jun 4, 2019·0 cites·14 claims
- 2139US10153241B2Semiconductor device and method of manufacturing the sameTOYOTA MOTOR CO LTD·Filed 2017·Granted Dec 11, 2018·0 cites·10 claims
- 2238US2018211930A1Semiconductor device and method for manufacturing the sameTOYOTA MOTOR CO LTD·Filed 2017·Application pending·0 cites
- 2338US2018308812A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2018·Application pending·0 cites
- 2436US2017162482A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →