Inventor · disambiguated record
Nathaniel P. Wyckoff
Also filed as: WYCKOFF NATHANIEL · WYCKOFF NATHANIEL P
20 granted patents·6 pending applications·27 citations·filing 2007–2023
90Inventor score
Files withROCKWELL COLLINS INC14BAE SYS INF & ELECT SYS INTEG6LOWER NATHAN P3BEAN REGINALD D1PALANDECH ROBERT L1
Top patents by PatentIndex Score
26 records- 0187US8119040B2Glass thick film embedded passive materialLOWER NATHAN P·Filed 2008·Granted Feb 21, 2012·13 cites·18 claims
- 0277US11493342B2Chip-scale gyrometric apparatusROCKWELL COLLINS INC·Filed 2020·Granted Nov 8, 2022·1 cites·13 claims
- 0369US8199457B1Microfabricated RF capacitorPALANDECH ROBERT L·Filed 2010·Granted Jun 12, 2012·4 cites·20 claims
- 0467US9177907B1High performance deposited die attachLOWER NATHAN P·Filed 2012·Granted Nov 3, 2015·2 cites·17 claims
- 0566US9355544B1Method and apparatus for optically storing a binary stateBEAN REGINALD D·Filed 2011·Granted May 31, 2016·3 cites·21 claims
- 0666US7965890B2Target recognition system and methodRAYTHEON CO·Filed 2007·Granted Jun 21, 2011·4 cites·61 claims
- 0759US11326246B2Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film depositionROCKWELL COLLINS INC·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 0858US11613802B2Additively manufactured shadow masks for material deposition controlROCKWELL COLLINS INC·Filed 2021·Granted Mar 28, 2023·0 cites·14 claims
- 0955US8585937B2Glass thick film embedded passive materialLOWER NATHAN P·Filed 2012·Granted Nov 19, 2013·0 cites·11 claims
- 1055US2025071911A1Anisotropic conductive substrates and methods of useBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
- 1150US11626286B1Custom photolithography masking via precision dispense processROCKWELL COLLINS INC·Filed 2020·Granted Apr 11, 2023·0 cites·12 claims
- 1250US11236436B2Controlled induced warping of electronic substrates via electroplatingROCKWELL COLLINS INC·Filed 2020·Granted Feb 1, 2022·0 cites·14 claims
- 1350US2024339365A1Resilient conductive bump for microelectronic testingBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
- 1449US11515225B2Reconstituted wafer including mold material with recessed conductive featureROCKWELL COLLINS INC·Filed 2020·Granted Nov 29, 2022·0 cites·18 claims
- 1549US2024413111A1Inline resistor integrated with conductive contact pad structureBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
- 1649US2024413105A1Conductive lines for interconnection in stacked device structuresBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
- 1749US2024412973A1Patterning using monomer based sacrificial material liftoffBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
- 1848US11469373B2System and device including memristor materialROCKWELL COLLINS INC·Filed 2020·Granted Oct 11, 2022·0 cites·19 claims
- 1948US11239182B2Controlled induced warping of electronic substratesROCKWELL COLLINS INC·Filed 2020·Granted Feb 1, 2022·0 cites·12 claims
- 2048US2025006779A1Capacitor structure integrated with contact pad structureBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
- 2147US11749539B1Maskless etching of electronic substrates via precision dispense processROCKWELL COLLINS INC·Filed 2020·Granted Sep 5, 2023·0 cites·7 claims
- 2247US11605570B2Reconstituted wafer including integrated circuit die mechanically interlocked with mold materialROCKWELL COLLINS INC·Filed 2020·Granted Mar 14, 2023·0 cites·12 claims
- 2346US11462267B2System and device including memristor materialROCKWELL COLLINS INC·Filed 2020·Granted Oct 4, 2022·0 cites·17 claims
- 2445US11276641B1Conformal multi-plane material depositionROCKWELL COLLINS INC·Filed 2020·Granted Mar 15, 2022·0 cites·11 claims
- 2543US11456418B2System and device including memristor materials in parallelROCKWELL COLLINS INC·Filed 2020·Granted Sep 27, 2022·0 cites·12 claims
- 2641US11631808B2System and device including memristor materialROCKWELL COLLINS INC·Filed 2020·Granted Apr 18, 2023·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →