Inventor · disambiguated record
Nai Hua Yeh
Also filed as: YEH NAI HUA
8 granted patents·11 pending applications·311 citations·filing 2000–2002
88Inventor score
Files withKINGPAK TECH INC5
Top patents by PatentIndex Score
19 records- 0194US6400007B1Stacked structure of semiconductor means and method for manufacturing the sameKINGPAK TECH INC·Filed 2001·Granted Jun 4, 2002·127 cites·11 claims
- 0289US6472736B1Stacked structure for memory chipsKINGPAK TECH INC·Filed 2002·Granted Oct 29, 2002·66 cites·5 claims
- 0386US6559539B2Stacked package structure of image sensorFiled 2001·Granted May 6, 2003·55 cites·10 claims
- 0482US6627983B2Stacked package structure of image sensorFiled 2001·Granted Sep 30, 2003·43 cites·12 claims
- 0569US6642137B2Method for manufacturing a package structure of integrated circuitsKINGPAK TECH INC·Filed 2002·Granted Nov 4, 2003·14 cites·5 claims
- 0645US6565008B2Module card and a method for manufacturing the sameKINGPAK TECH INC·Filed 2000·Granted May 20, 2003·3 cites·10 claims
- 0737US6501187B1Semiconductor package structure having central leads and method for packaging the sameFiled 2001·Granted Dec 31, 2002·1 cites·8 claims
- 0834US2003116846A1Stacked structure of a ball grid array (BGA) integrated circuit packageFiled 2001·Application pending·0 cites
- 0932US6642554B2Memory module structureKINGPAK TECH INC·Filed 2001·Granted Nov 4, 2003·2 cites·8 claims
- 1032US2003116817A1Image sensor structureFiled 2001·Application pending·0 cites
- 1132US2002043709A1Stackable integrated circuitFiled 2001·Application pending·0 cites
- 1231US2002096751A1Integrated circuit structure having an adhesive agent and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 1331US2002096729A1Stacked package structure of image sensorFiled 2001·Application pending·0 cites
- 1430US2002096766A1Package structure of integrated circuits and method for packaging the sameFiled 2001·Application pending·0 cites
- 1528US2002096754A1Stacked structure of integrated circuitsFiled 2001·Application pending·0 cites
- 1627US2002151102A1Stacked semiconductor package structure having films and method for manufacturing the filmsFiled 2001·Application pending·0 cites
- 1727US2002096747A1Package structure of an integrated circuitFiled 2001·Application pending·0 cites
- 1826US2002096761A1Structure of stacked integrated circuits and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 1926US2002096762A1Structure of stacked integrated circuits and method for manufacturing the sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →