Inventor · disambiguated record
Naoki Yokoi
Also filed as: YOKOI NAOKI
19 granted patents·12 pending applications·241 citations·filing 1983–2021
94Inventor score
Files withMITSUBISHI ELECTRIC CORP12ELPIDA MEMORY INC6MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3RENESAS TECH CORP3FUJI XEROX CO LTD2
Top patents by PatentIndex Score
31 records- 0186US4603970AApparatus for inhibiting copying of confidential documentsFUJI XEROX CO LTD·Filed 1983·Granted Aug 5, 1986·33 cites·8 claims
- 0281US4544936AHeat-sensitive recording sheetFUJI XEROX CO LTD·Filed 1983·Granted Oct 1, 1985·23 cites·21 claims
- 0378US7332395B2Method of manufacturing a capacitorELPIDA MEMORY INC·Filed 2005·Granted Feb 19, 2008·6 cites·13 claims
- 0476US6837963B2Semiconductor device, method of producing a semiconductor device, and semiconductor substrate cleaning apparatus used for the production methodRENESAS TECH CORP·Filed 2001·Granted Jan 4, 2005·19 cites·6 claims
- 0576US6482750B2Method of manufacturing semiconductor device including a cleaning step, and semiconductor device manufactured therebyMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 19, 2002·19 cites·19 claims
- 0675US7919803B2Semiconductor memory device having a capacitor structure with a desired capacitance and manufacturing method thereforELPIDA MEMORY INC·Filed 2008·Granted Apr 5, 2011·6 cites·17 claims
- 0773US5956859ADrying apparatus for processing surface of substrateRYODEN SEMICONDUCTOR SYST ENG·Filed 1997·Granted Sep 28, 1999·45 cites·18 claims
- 0869US8258630B2Semiconductor device and method of manufacturing the sameYOKOI NAOKI·Filed 2009·Granted Sep 4, 2012·6 cites·7 claims
- 0966US6642142B2Substrate cleaning method and method for producing an electronic deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 4, 2003·11 cites·15 claims
- 1066US6032382ADrying apparatus and method using IPA of a semiconductor waferMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 7, 2000·33 cites·15 claims
- 1161US6586145B2Method of fabricating semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 1, 2003·8 cites·10 claims
- 1258US6730239B1Cleaning agent for semiconductor device & method of fabricating semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted May 4, 2004·7 cites·8 claims
- 1355US6596630B2Method of cleaning a silicon substrate after blanket depositing a tungsten film by dipping in a solution of hydrofluoric acid, hydrochloric acid, and/or ammonium hydroxideMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 22, 2003·4 cites·3 claims
- 1451US12051631B2Stacked semiconductor device with removable probe padsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 30, 2024·0 cites·17 claims
- 1547US2009088909A1Batch processing apparatus for processing work piecesELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 1644US2007131358A1Shutter curtain lifting prevention structure in shutter deviceIWASAKI SHINYA·Filed 2004·Application pending·0 cites
- 1740US7494864B2Method for production of semiconductor deviceELPIDA MEMORY INC·Filed 2006·Granted Feb 24, 2009·0 cites·5 claims
- 1840US6531381B2Method and apparatus for cleaning semiconductor device and method of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Mar 11, 2003·0 cites·7 claims
- 1940US2003139046A1Method and apparatus for cleaning semiconductor device and method of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 2040US2007158723A1Semiconductor storage device with improved degree of memory cell integration and method of manufacturing thereofELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 2140US2007202649A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 2239US6432815B2Method of cleaning a silicon substrate after blanket depositing a tungsten film by dipping in a solution having hydrofluoric acid, hydrochloric acid, and/or ammonium hydroxide prior to patterning the tungsten filmMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Aug 13, 2002·6 cites·19 claims
- 2339US5996242ADrying apparatus and methodRYODEN SEMICONDUCTOR SYST ENG·Filed 1997·Granted Dec 7, 1999·8 cites·20 claims
- 2437US6391113B1Semiconductor wafer processing apparatus and method of controlling the sameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted May 21, 2002·7 cites·19 claims
- 2537US2004016447A1Cleaning equipment and cleaning methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
- 2636US2003159716A1Wafer cleaning methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Application pending·0 cites
- 2735US2005024812A1Semiconductor device with capacitor and manufacturing method thereofRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 2835US2002146911A1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 2934US2003214017A1Method of manufacturing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 3033US2003106567A1Semiconductor substrate cleaning apparatus, method of cleaning semiconductor substrate and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 3133US2004011388A1Cleaning apparatus for cleaning semiconductor substrate, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →