Inventor · disambiguated record
Naohito Yoshida
Also filed as: YOSHIDA NAOHITO
16 granted patents·2 pending applications·365 citations·filing 1991–2020
94Inventor score
Top patents by PatentIndex Score
18 records- 0193US9441628B2Electric pump unitSAKATA TAKATOSHI·Filed 2010·Granted Sep 13, 2016·13 cites·9 claims
- 0291US6013926ASemiconductor device with refractory metal elementMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jan 11, 2000·110 cites·5 claims
- 0381US9638190B2Oil pumpJTEKT CORP·Filed 2014·Granted May 2, 2017·3 cites·5 claims
- 0477US6307245B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 23, 2001·24 cites·3 claims
- 0576US5677553ASemiconductor device strucutre having a two-dimensional electron gas and contact theretoMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Oct 14, 1997·39 cites·21 claims
- 0674US5739558AHigh electron mobility transistor including asymmetrical carrier supply layers sandwiching a channel layerMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Apr 14, 1998·36 cites·9 claims
- 0774US5210767ASemiconductor laserMITSUBISHI ELECTRIC CORP·Filed 1991·Granted May 11, 1993·35 cites·11 claims
- 0871US5181086AStrained superlattice semiconductor structureMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jan 19, 1993·37 cites·9 claims
- 0965US5883407ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 16, 1999·33 cites·8 claims
- 1061US5414273AHeterojunction bipolar transistorMITSUBISHI ELECTRIC CORP·Filed 1994·Granted May 9, 1995·19 cites·10 claims
- 1160US10851776B2Sliding member and sliding machineTOYOTA CHUO KENKYUSHO KK·Filed 2019·Granted Dec 1, 2020·0 cites·8 claims
- 1254US11396874B2Vane pump including fluid communication passages for routing fluid received from two inflow passages around outer peripheral surface of the entire perimeter of the cam ringAISIN CORP·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 1351US5739062AMethod of making bipolar transistorMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Apr 14, 1998·13 cites·12 claims
- 1445US10451063B2Vane pump including back pressure groovesJTEKT CORP·Filed 2017·Granted Oct 22, 2019·0 cites·4 claims
- 1545US2009039487A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2008·Application pending·0 cites
- 1643US2017335846A1Gear PumpJTEKT CORP·Filed 2017·Application pending·0 cites
- 1733US8423082B2Imaging device, imaging method and programOOZEKI KEISUKE·Filed 2010·Granted Apr 16, 2013·0 cites·13 claims
- 1831US5728611AMethod of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 17, 1998·3 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →