Inventor · disambiguated record
Naoki Yoshimatsu
Also filed as: YOSHIMATSU NAOKI
36 granted patents·20 pending applications·580 citations·filing 1993–2023
97Inventor score
Files withMITSUBISHI ELECTRIC CORP42YOSHIMATSU NAOKI5TANAKA TAKESHI3PANASONIC IP MAN CO LTD2IWAHASHI DAISUKE1
Top patents by PatentIndex Score
56 records- 0196US6521983B1Semiconductor device for electric powerMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Feb 18, 2003·137 cites·20 claims
- 0294US7656016B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Feb 2, 2010·38 cites·16 claims
- 0390US5767573ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jun 16, 1998·138 cites·17 claims
- 0488US6762937B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 13, 2004·41 cites·2 claims
- 0586US10104775B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Oct 16, 2018·9 cites·13 claims
- 0686US6509629B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jan 21, 2003·46 cites·5 claims
- 0784US6522544B1Power moduleMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Feb 18, 2003·31 cites·5 claims
- 0881US6900986B2Power moduleRYODEN SEMICONDUCTOR SYST ENG·Filed 2004·Granted May 31, 2005·25 cites·4 claims
- 0980US9437460B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Sep 6, 2016·5 cites·5 claims
- 1080US8982964B2Image decoding device, image coding device, methods thereof, programs thereof, integrated circuits thereof, and transcoding deviceTANAKA TAKESHI·Filed 2011·Granted Mar 17, 2015·4 cites·21 claims
- 1179US12334408B2Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jun 17, 2025·1 cites·7 claims
- 1279US8401073B2Inverse quantization circuit, inverse quantization method and image reproducing apparatusYOSHIMATSU NAOKI·Filed 2008·Granted Mar 19, 2013·6 cites·19 claims
- 1377US9418910B2Semiconductor deviceMIYAMOTO NOBORU·Filed 2012·Granted Aug 16, 2016·4 cites·3 claims
- 1477US9185406B2Image decoding device, image coding device, methods thereof, programs thereof, integrated circuits thereof, and transcoding deviceTANAKA TAKESHI·Filed 2011·Granted Nov 10, 2015·3 cites·20 claims
- 1576US9059334B2Power semiconductor module and method of manufacturing the sameUSUI OSAMU·Filed 2012·Granted Jun 16, 2015·5 cites·11 claims
- 1674US6940164B1Power moduleMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 6, 2005·20 cites·6 claims
- 1774US6563211B2Semiconductor device for controlling electricityMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 13, 2003·24 cites·5 claims
- 1871US6787893B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 7, 2004·19 cites·19 claims
- 1969US9455215B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Sep 27, 2016·2 cites·11 claims
- 2067US11101225B2Semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Aug 24, 2021·1 cites·15 claims
- 2166US11239123B2Semiconductor module, semiconductor device, and vehicleMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Feb 1, 2022·2 cites·15 claims
- 2263US9307260B2Image decoding apparatus, image decoding method, image coding apparatus, and image coding methodYOSHIMATSU NAOKI·Filed 2011·Granted Apr 5, 2016·1 cites·16 claims
- 2361US9698091B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 4, 2017·1 cites·8 claims
- 2460US12500135B2Semiconductor device comprising semiconductor element; insulating component; lead electrode; and first bonding material, second bonding material, third bonding material, and fourth bonding material made of a same materialMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Dec 16, 2025·0 cites·22 claims
- 2560US8422562B2Decoding circuit, decoding method, and image reproducing apparatusYOSHIMATSU NAOKI·Filed 2008·Granted Apr 16, 2013·2 cites·22 claims
- 2659US2024258134A1Semiconductor manufacturing apparatus and method for manufacturing a semiconductor manufacturing apparatusMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2757US2024258267A1Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2857US2024178100A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2957US2024120307A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3055US2023282541A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3153US10038901B2Image encoding method and image encoding apparatusPANASONIC IP MAN CO LTD·Filed 2017·Granted Jul 31, 2018·0 cites·7 claims
- 3253US2014367842A1Power semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Application pending·0 cites
- 3352US12243789B2Semiconductor device, semiconductor system, moving body, and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Mar 4, 2025·0 cites·13 claims
- 3451US2014070398A1Power semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2013·Application pending·0 cites
- 3550US8249182B2Decoding circuit, decoding method, encoding circuit, and encoding methodYOSHIMATSU NAOKI·Filed 2008·Granted Aug 21, 2012·0 cites·16 claims
- 3650US2025132230A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 3750US2025079271A1Semiconductor device, power converter, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3850US2010322317A1Image decoding apparatus and image decoding methodYOSHIMATSU NAOKI·Filed 2009·Application pending·0 cites
- 3949US9723326B2Image encoding method and image encoding appartausPANASONIC IP MAN CO LTD·Filed 2015·Granted Aug 1, 2017·0 cites·7 claims
- 4049US2025167079A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4149US2025183783A1Inverter and electric-driven vehicleMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4248US2024162196A1Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 4347US5463251APower semiconductor package having improved durabilityMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Oct 31, 1995·15 cites·17 claims
- 4447US2023187225A1Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 4547US2024063073A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 4646US11562977B2Semiconductor device comprising a resin case and a wiring member that is flat in the resin caseMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 24, 2023·0 cites·5 claims
- 4746US10707141B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 7, 2020·0 cites·7 claims
- 4845US12341078B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jun 24, 2025·0 cites·17 claims
- 4945US2023012134A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 5044US2023141875A1Cooler and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →