Inventor · disambiguated record
Neng-Chieh Chang
Also filed as: CHANG NENG-CHIEH
2 granted patents·2 pending applications·0 citations·filing 2021–2025
31Inventor score
Top patents by PatentIndex Score
4 records- 0178US12255166B2Semiconductor package structure comprising via structure and redistribution layer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 0272US2025192087A1Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0369US11817413B2Semiconductor package structure comprising via structure and redistribution layer structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 0450US2025081404A1Server system and heat dissipation moduleWIWYNN CORP·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →