Inventor · disambiguated record
Neo Yong Loo
Also filed as: LOO NEO YONG
18 granted patents·1,171 citations·filing 2001–2010
96Inventor score
Top patents by PatentIndex Score
18 records- 0199US6611052B2Wafer level stackable semiconductor packageMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·261 cites·39 claims
- 0299US6582992B2Stackable semiconductor package and wafer level fabrication methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 24, 2003·283 cites·19 claims
- 0397US6949407B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 27, 2005·42 cites·18 claims
- 0497US6727116B2Semiconductor devices including peripherally located bond pads, assemblies, packages, and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 27, 2004·149 cites·25 claims
- 0596US6855572B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 15, 2005·96 cites·41 claims
- 0695US7358154B2Method for fabricating packaged dieMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 15, 2008·30 cites·24 claims
- 0794US8106488B2Wafer level packagingCHUA SWEE KWANG·Filed 2010·Granted Jan 31, 2012·18 cites·18 claims
- 0894US7285850B2Support elements for semiconductor devices with peripherally located bond padsMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 23, 2007·26 cites·27 claims
- 0994US7115984B2Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 3, 2006·67 cites·10 claims
- 1094US6894386B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted May 17, 2005·69 cites·30 claims
- 1193US6818977B2Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 16, 2004·60 cites·43 claims
- 1288US7528477B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted May 5, 2009·10 cites·22 claims
- 1386US7679179B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 16, 2010·8 cites·19 claims
- 1485US8008126B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 30, 2011·7 cites·14 claims
- 1584US7675169B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 9, 2010·9 cites·20 claims
- 1677US8138617B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2004·Granted Mar 20, 2012·19 cites·15 claims
- 1775US7226809B2Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 5, 2007·15 cites·48 claims
- 1870US7276387B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 2, 2007·2 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →