Inventor · disambiguated record
Neelam Prabhu Gaunkar
Also filed as: PRABHU GAUNKAR NEELAM
16 granted patents·26 pending applications·0 citations·filing 2020–2024
84Inventor score
Top patents by PatentIndex Score
42 records- 0180US2024429588A1Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 0268US12126068B2Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materialsINTEL CORP·Filed 2020·Granted Oct 22, 2024·0 cites·20 claims
- 0363US2025054672A1Selectively transferred inductors with electroplated magnetic materialINTEL CORP·Filed 2023·Application pending·0 cites
- 0462US12347761B2Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrateINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·23 claims
- 0561US12166261B2Components for millimeter-wave communicationINTEL CORP·Filed 2020·Granted Dec 10, 2024·0 cites·20 claims
- 0660US11955684B2Components for millimeter-wave communicationINTEL CORP·Filed 2020·Granted Apr 9, 2024·0 cites·20 claims
- 0760US2025279342A1Metal seed layers with different sheet resistances in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0859US12424716B2RF filters and multiplexers manufactured in the core of a package substrate using glass core technologyINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·25 claims
- 0959US12368091B2Package substrate with glass core having vertical power planes for improved power deliveryINTEL CORP·Filed 2021·Granted Jul 22, 2025·0 cites·25 claims
- 1058US12444619B2Physical vapor deposition seeding for high aspect ratio vias in glass core technologyINTEL CORP·Filed 2021·Granted Oct 14, 2025·0 cites·11 claims
- 1158US12255158B2Components for millimeter-wave communicationINTEL CORP·Filed 2020·Granted Mar 18, 2025·0 cites·21 claims
- 1258US12126067B2Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second materialINTEL CORP·Filed 2020·Granted Oct 22, 2024·0 cites·20 claims
- 1358US2025079300A1Magnetic inductors for semiconductor packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 1457US12424719B2Compact surface transmission line waveguides with vertical ground planesINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·24 claims
- 1557US12107314B2Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-padINTEL CORP·Filed 2020·Granted Oct 1, 2024·0 cites·17 claims
- 1656US2024371799A1Through core via coaxial-type inductors with two or more magnetic materials for power delivery applicationsINTEL CORP·Filed 2023·Application pending·0 cites
- 1755US12489189B2Contactless communication using a waveguide extending through a substrate coreINTEL CORP·Filed 2021·Granted Dec 2, 2025·0 cites·18 claims
- 1855US12255225B2Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodesINTEL CORP·Filed 2020·Granted Mar 18, 2025·0 cites·20 claims
- 1955US12021289B2Components for millimeter-wave communicationINTEL CORP·Filed 2020·Granted Jun 25, 2024·0 cites·25 claims
- 2055US11916604B2Dispersion compensation for electromagnetic waveguidesINTEL CORP·Filed 2020·Granted Feb 27, 2024·0 cites·20 claims
- 2151US2023207407A1Plate-up hybrid structures using modified glass patterning processesINTEL CORP·Filed 2021·Application pending·0 cites
- 2251US2023198058A1Embedded batteries within glass cores of package substratesINTEL CORP·Filed 2021·Application pending·0 cites
- 2351US2023207408A1Suspended structures in glass using modified glass patterning processesINTEL CORP·Filed 2021·Application pending·0 cites
- 2451US2023208010A13d arrayed glass-based mmwave and thz structuresINTEL CORP·Filed 2021·Application pending·0 cites
- 2551US2023197620A1Methods, systems, apparatus, and articles of manufacture for integrated circuit package substrates with high aspect ratio through glass viasINTEL CORP·Filed 2021·Application pending·0 cites
- 2650US2023207404A1Coaxial inductors fabricated through a drill-less via processKAMGAING TELESPHOR·Filed 2021·Application pending·0 cites
- 2750US2023207492A1Coaxial inductor with plated high resistivity and high permeability magnetic materialALEKSOV ALEKSANDAR·Filed 2021·Application pending·0 cites
- 2850US2023197592A1Power delivery techniques for glass substrate with high density signal viasINTEL CORP·Filed 2021·Application pending·0 cites
- 2949US2022406617A1Dual sided glass interconnect dual damascene viasINTEL CORP·Filed 2021·Application pending·0 cites
- 3049US2022407203A1Coaxial structure in a glass substrateINTEL CORP·Filed 2021·Application pending·0 cites
- 3149US2022407216A1In-package mmwave antennas and launchers using glass core technologyINTEL CORP·Filed 2021·Application pending·0 cites
- 3249US2022406523A1Capacitors in a glass substrateINTEL CORP·Filed 2021·Application pending·0 cites
- 3349US2022416391A1Signal and ground vias in a glass core to control impedanceINTEL CORP·Filed 2021·Application pending·0 cites
- 3449US2023197646A1Low loss microstrip and stripline routing with blind trench vias for high speed signaling on a glass coreINTEL CORP·Filed 2021·Application pending·0 cites
- 3549US2022406725A1Glass package core with planar structuresINTEL CORP·Filed 2021·Application pending·0 cites
- 3649US2022406686A1Glass-based cavity and channels for cooling of embedded dies and 3d integrated modules using package substrates with glass coreINTEL CORP·Filed 2021·Application pending·0 cites
- 3749US2022415779A1Angled interconnect using glass core technologyINTEL CORP·Filed 2021·Application pending·0 cites
- 3849US2022404568A1Package with optical waveguide in a glass coreINTEL CORP·Filed 2021·Application pending·0 cites
- 3949US2022407212A1Millimeter wave components in a glass core of a substrateINTEL CORP·Filed 2021·Application pending·0 cites
- 4048US2022408562A1Integrated rf passive devices on glassINTEL CORP·Filed 2021·Application pending·0 cites
- 4147US2024006735A1Stacked transceiver and waveguide launcher arrayINTEL CORP·Filed 2022·Application pending·0 cites
- 4246US12088360B2Dispersive waveguide crosstalk mitigationINTEL CORP·Filed 2020·Granted Sep 10, 2024·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →