Inventor · disambiguated record

Neng-Jye Yang

Also filed as: YANG NENG-JYE

38 granted patents·11 pending applications·46 citations·filing 2013–2025

96Inventor score

Technology areasH10P H10W H01L

Files withTAIWAN SEMICONDUCTOR MFG CO LTD48 TAIWAN SEMICONDUCTOR MFG1

Top patents by PatentIndex Score

49 records

0198US11600521B2Surface modification layer for conductive feature formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·5 cites·20 claims
0294US11342222B2Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·3 cites·20 claims
0390US10312106B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·5 cites·20 claims
0489US10699944B2Surface modification layer for conductive feature formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·3 cites·20 claims
0589US10179878B2Wet etch chemistry for selective silicon etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 15, 2019·5 cites·20 claims
0689US9460997B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 4, 2016·7 cites·20 claims
0788US2025300008A1Surface modification layer for conductive feature formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0887US12347724B2Surface modification layer for conductive feature formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
0987US10483108B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 19, 2019·3 cites·20 claims
1086US12188686B2Air curtain device and workpiece processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·1 cites·20 claims
1186US10685870B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 16, 2020·4 cites·20 claims
1286US2025329584A1Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1384US11942362B2Surface modification layer for conductive feature formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 26, 2024·0 cites·20 claims
1484US11378882B2Chemical composition for tri-layer removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·1 cites·20 claims
1584US9589800B2Method for integrated circuit patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 7, 2017·3 cites·20 claims
1682US2024282575A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1782US2024404953A1Diffusion barrier layer for conductive via to decrease contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1880US12387977B2Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
1980US12368103B2Diffusion barrier layer for conductive via to decrease contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
2080US12112953B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
2180US11362035B2Diffusion barrier layer for conductive via to decrease contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·1 cites·20 claims
2280US2024395559A1Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2379US10676668B2Wet etch chemistry for selective silicon etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 9, 2020·2 cites·20 claims
2476US11990339B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
2576US11742291B2Diffusion barrier layer for conductive via to decrease contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
2675US11923199B2Method and structure of middle layer removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
2775US11830770B2Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
2874US11735426B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
2974US2024379436A1Self-aligned interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3073US9129814B2Method for integrated circuit patterningTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 8, 2015·2 cites·20 claims
3172US2025109870A1Air curtain device and workpiece processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3271US11776818B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
3371US10312073B2Selective removal of carbon-containing and nitrogen-containing silicon residuesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 4, 2019·1 cites·20 claims
3467US11398380B2Method and structure of middle layer removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
3567US11081350B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·0 cites·20 claims
3666US11101135B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
3766US2022277989A1Semiconductor Device and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
3864US12494432B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
3964US11335589B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·0 cites·20 claims
4063US10985028B1Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
4162US10867803B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
4261US10529572B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·0 cites·21 claims
4361US2023011792A1Self-Aligned Interconnect Structure And Method Of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
4460US10658179B2Method and structure of middle layer removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·0 cites·20 claims
4558US10062645B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·0 cites·20 claims
4657US9679848B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·0 cites·20 claims
4754US10761423B2Chemical composition for tri-layer removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 1, 2020·0 cites·20 claims
4854US2022334473A1Chemical Composition for Tri-Layer RemovalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
4954US2024266216A1Metal structures with seamsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →