Inventor · disambiguated record
Nicolas Boyer
Also filed as: BOYER NICOLAS
11 granted patents·45 citations·filing 2011–2018
87Inventor score
Top patents by PatentIndex Score
11 records- 0194US10295749B1Optical interconnect attach to photonic device with partitioning adhesive functionIBM·Filed 2018·Granted May 21, 2019·13 cites·15 claims
- 0294US9568682B1Component and chip assembly structure for high yield parallelized fiber assemblyIBM·Filed 2016·Granted Feb 14, 2017·20 cites·20 claims
- 0384US9662830B2Bondline control fixture and method of affixing first and second componentsIBM·Filed 2015·Granted May 30, 2017·2 cites·15 claims
- 0484US9656420B2Bondline control fixture and method of affixing first and second componentsIBM·Filed 2015·Granted May 23, 2017·2 cites·17 claims
- 0576US10338325B1Nanofiller in an optical interfaceIBM·Filed 2018·Granted Jul 2, 2019·2 cites·19 claims
- 0676US9651747B1Fiber pigtail assembly with integrated lid enabling optical fiber mobilityIBM·Filed 2016·Granted May 16, 2017·2 cites·20 claims
- 0770US9810864B2Fiber pigtail assembly with integrated lid enabling optical fiber mobilityIBM·Filed 2017·Granted Nov 7, 2017·1 cites·20 claims
- 0863US9338935B2System for removing an electronic component from a substrateIBM·Filed 2014·Granted May 10, 2016·2 cites·10 claims
- 0959US10302869B1Optical interconnect attach to photonic device with partitioning adhesive functionIBM·Filed 2018·Granted May 28, 2019·0 cites·20 claims
- 1048US8925170B2Method for removing an electronic component from a substrateBESSETTE YVAN·Filed 2011·Granted Jan 6, 2015·1 cites·11 claims
- 1147US9684133B2Component assembly apparatusIBM·Filed 2014·Granted Jun 20, 2017·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →