Inventor · disambiguated record
Nicholas L. Campbell
Also filed as: CAMPBELL NICHOLAS L
1 granted patent·3 pending applications·0 citations·filing 2023–2025
13Inventor score
Files withBAE SYS INF & ELECT SYS INTEG4
Top patents by PatentIndex Score
4 records- 0168US2025364387A1Interposer for implementing flip-chip dies in wirebonded circuit assembliesBAE SYS INF & ELECT SYS INTEG·Filed 2025·Application pending·0 cites
- 0258US12400942B2Interposer for implementing flip-chip dies in wirebonded circuit assembliesBAE SYS INF & ELECT SYS INTEG·Filed 2023·Granted Aug 26, 2025·0 cites·12 claims
- 0348US2025183571A1Interposer module for implementing densely pitched integrated circuits on conventional motherboardsBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
- 0446US2025180639A1Breakout connector platform for interposer modules that implement densely pitched integrated circuits on conventional motherboardsBAE SYS INF & ELECT SYS INTEG·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →