Inventor · disambiguated record
Nien-Tien Cheng
Also filed as: CHENG NIEN-TIEN
26 granted patents·25 pending applications·353 citations·filing 1998–2017
95Inventor score
Files withFOXCONN TECH CO LTD23CHENG NIEN-TIEN4CHUNG MING-HSIU3FOXCONN PREC COMPONENTS CO LTD3UER TECHNOLOGY CORP3
Top patents by PatentIndex Score
51 records- 0195US6233150B1Memory module assemblyFOXCONN PREC COMPONENTS CO LTD·Filed 1999·Granted May 15, 2001·126 cites·6 claims
- 0293US7948750B2Portable electronic device incorporating extendable thermal moduleFOXCONN TECH CO LTD·Filed 2009·Granted May 24, 2011·29 cites·18 claims
- 0388US8339786B2Heat dissipation deviceCHENG NIEN-TIEN·Filed 2010·Granted Dec 25, 2012·12 cites·10 claims
- 0488US6343020B1Memory moduleFOXCONN PREC COMPONENTS CO LTD·Filed 1999·Granted Jan 29, 2002·100 cites·13 claims
- 0586US7460370B2Heat dissipation assemblyFOXCONN TECH CO LTD·Filed 2006·Granted Dec 2, 2008·19 cites·17 claims
- 0681US7869215B2Portable electronic device incorporating extendable heat dissipation deviceFOXCONN TECH CO LTD·Filed 2009·Granted Jan 11, 2011·11 cites·15 claims
- 0780US8667684B2Flat heat pipe and method for manufacturing the sameDai sheng-liang·Filed 2010·Granted Mar 11, 2014·5 cites·1 claims
- 0878US7537049B2Heat dissipation apparatusFOXCONN TECH CO LTD·Filed 2006·Granted May 26, 2009·9 cites·3 claims
- 0972US7656659B2Notebook computer with thermal moduleFU ZHUN PRECISION IND SHENZHEN·Filed 2008·Granted Feb 2, 2010·5 cites·20 claims
- 1071US8245763B2Heat dissipation device with guilding lines and soldered heat pipes and manufacturing method thereofZHANG MING-TANG·Filed 2009·Granted Aug 21, 2012·4 cites·4 claims
- 1167US9145895B2Heat dissipation fanCHENG NIEN-TIEN·Filed 2012·Granted Sep 29, 2015·3 cites·19 claims
- 1266US8622117B2Heat pipe including a main wick structure and at least one auxiliary wick structureWU SHENG-LIN·Filed 2009·Granted Jan 7, 2014·5 cites·1 claims
- 1366US7381346B2Thermal interface materialFOXCONN TECH CO LTD·Filed 2006·Granted Jun 3, 2008·3 cites·14 claims
- 1462US7701717B2Notebook computer having heat pipeFOXCONN TECH CO LTD·Filed 2008·Granted Apr 20, 2010·2 cites·8 claims
- 1561US8459336B2Heat dissipation device with guiding line and soldered heat pipeZHANG MING-TANG·Filed 2012·Granted Jun 11, 2013·1 cites·1 claims
- 1661US2011030923A1Thermal moduleFOXCONN TECH CO LTD·Filed 2009·Application pending·0 cites
- 1760US9276420B2Battery power system having high working stabilityUER TECHNOLOGY CORP·Filed 2013·Granted Mar 1, 2016·2 cites·16 claims
- 1860US9186832B2Heat dissipating assembly and mold having the sameFOXCONN TECH CO LTD·Filed 2013·Granted Nov 17, 2015·0 cites·20 claims
- 1956US2010155031A1Heat pipe and method of making the sameFURUI PRECISE COMPONENT KUNSHA·Filed 2009·Application pending·0 cites
- 2054US2007148425A1Thermal interface material and semiconductor device incorporating the sameFOXCONN TECH CO LTD·Filed 2006·Application pending·0 cites
- 2152US9453689B2Flat heat pipeFURUI PRECISE COMPONENT (KUNSHAN) CO LTD·Filed 2013·Granted Sep 27, 2016·0 cites·11 claims
- 2252US7740050B2Mold for manufacturing heat dissipation apparatusFU ZHUN PRECISION IND SHENZHEN·Filed 2007·Granted Jun 22, 2010·0 cites·14 claims
- 2351US8578605B2Manufacturing method of a heat dissipation device with guiding lines and soldered heat pipesZHANG MING-TANG·Filed 2012·Granted Nov 12, 2013·0 cites·5 claims
- 2451US2013160976A1Heat pipe with composite wick structureWu jia-hong·Filed 2012·Application pending·0 cites
- 2550US2007161517A1Silicone grease compositionFOXCONN TECH CO LTD·Filed 2006·Application pending·0 cites
- 2649US2007167564A1Heat conductive silicone compositionFOXCONN TECH CO LTD·Filed 2006·Application pending·0 cites
- 2748US7728052B2Thermal interface material and method of producing the sameFOXCONN TECH CO LTD·Filed 2006·Granted Jun 1, 2010·0 cites·8 claims
- 2848US2015086828A1Battery power systemUER TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 2948US2015086827A1Battery module having heat dissipating assemblyUER TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 3047US8845315B2Injection molding apparatus having a thermostat assemblyCHENG NIEN-TIEN·Filed 2012·Granted Sep 30, 2014·0 cites·20 claims
- 3146US2007131055A1Thermal interface material and semiconductor device incorporating the sameFOXCONN TECH CO LTD·Filed 2006·Application pending·0 cites
- 3246US2012292007A1Heat disspation device and control methodCHIU HUNG-NIEN·Filed 2011·Application pending·0 cites
- 3345USD419979SComputer cooling deviceHON HAI PREC IND CO LTD·Filed 1998·Granted Feb 1, 2000·5 cites·1 claims
- 3445US2007131913A1Thermal interface material and semiconductor device incorporating the sameFOXCONN TECH CO LTD·Filed 2006·Application pending·0 cites
- 3545US2013239410A1Method for manufacturing heat pipeFOXCONN TECH CO LTD·Filed 2012·Application pending·0 cites
- 3645US2010212870A1Flat heat pipeFURUI PRECISE COMPONENT KUNSHA·Filed 2009·Application pending·0 cites
- 3744US6418393B1Thermal module inspecting deviceFOXCONN PREC COMPONENTS CO LTD·Filed 1998·Granted Jul 9, 2002·12 cites·7 claims
- 3844US2007235683A1Heat conductive silicone grease compositionFOXCONN TECH CO LTD·Filed 2006·Application pending·0 cites
- 3943US8956483B2Manufacturing method of casing of heat pipeCHUNG MING-HSIU·Filed 2012·Granted Feb 17, 2015·0 cites·5 claims
- 4042US7541403B2Thermal interface materialFOXCONN TECH CO LTD·Filed 2006·Granted Jun 2, 2009·0 cites·16 claims
- 4142US2007151416A1Thermal interface material and semiconductor device incorporating the sameFOXCONN TECH CO LTD·Filed 2006·Application pending·0 cites
- 4242US2007187460A1Thermal interface material and semiconductor device incorporating the sameFOXCONN TECH CO LTD·Filed 2006·Application pending·0 cites
- 4341US2007195500A1Heat dissipation apparatusFOXCONN TECH CO LTD·Filed 2006·Application pending·0 cites
- 4440US2017305746A1Method for making grapheneFOXCONN TECH CO LTD·Filed 2017·Application pending·0 cites
- 4540US2013312938A1Heat pipe with vaporized working fluid flow acceleratorCHENG NIEN-TIEN·Filed 2012·Application pending·0 cites
- 4637US2013037244A1Flat heat pipeWU SHENG-LIN·Filed 2012·Application pending·0 cites
- 4737US2013224057A1Manufacturing method of bearing deviceCHUNG MING-HSIU·Filed 2012·Application pending·0 cites
- 4837US2017374762A1Heat pipe assembly and electronic deviceFOXCONN TECH CO LTD·Filed 2017·Application pending·0 cites
- 4936US2016120063A1Liquid cooling system having heat dissipation fins thereinFOXCONN TECH CO LTD·Filed 2014·Application pending·0 cites
- 5034US2013223773A1Bearing deviceCHUNG MING-HSIU·Filed 2012·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →