Inventor · disambiguated record

Nikhil Kelkar

Also filed as: KELHAR NIKHIL V · KELKAR NIKHIL

7 granted patents·508 citations·filing 1999–2005

90Inventor score

Technology areasH10W

Files withNAT SEMICONDUCTOR CORP7

Top patents by PatentIndex Score

7 records

0196US7413927B1Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packagesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Aug 19, 2008·44 cites·10 claims
0296US6607941B2Process and structure improvements to shellcase style packaging technologyNAT SEMICONDUCTOR CORP·Filed 2002·Granted Aug 19, 2003·141 cites·17 claims
0394US6238949B1Method and apparatus for forming a plastic chip on chip package moduleNAT SEMICONDUCTOR CORP·Filed 1999·Granted May 29, 2001·156 cites·15 claims
0491US7301222B1Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packagesNAT SEMICONDUCTOR CORP·Filed 2003·Granted Nov 27, 2007·55 cites·7 claims
0584US6352881B1Method and apparatus for forming an underfill adhesive layerNAT SEMICONDUCTOR CORP·Filed 1999·Granted Mar 5, 2002·70 cites·8 claims
0683US7253078B1Method and apparatus for forming an underfill adhesive layerNAT SEMICONDUCTOR CORP·Filed 2002·Granted Aug 7, 2007·31 cites·32 claims
0763US7423337B1Integrated circuit device package having a support coating for improved reliability during temperature cyclingNAT SEMICONDUCTOR CORP·Filed 2003·Granted Sep 9, 2008·11 cites·20 claims

Join the waitlist — get patent alerts

Get an alert when Nikhil Kelkar files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →