Inventor · disambiguated record
Nick Maccrae
Also filed as: MACCRAE NICK
2 granted patents·15 citations·filing 1998–2001
57Inventor score
Technology areasH10W
Files withADVANCED MICRO DEVICES INC2
Top patents by PatentIndex Score
2 records- 0147US6492258B1METHOD FOR REDUCING STRESS-INDUCED VOIDS FOR 0.25-μM AND SMALLER SEMICONDUCTOR CHIP TECHNOLOGY BY ANNEALING INTERCONNECT LINES AND USING LOW BIAS VOLTAGE AND LOW INTERLAYER DIELECTRIC DEPOSITION RATE AND SEMICONDUCTOR CHIP MADE THEREBYADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 10, 2002·3 cites·8 claims
- 0245US6329718B1Method for reducing stress-induced voids for 0.25mμ and smaller semiconductor chip technology by annealing interconnect lines and using low bias voltage and low interlayer dielectric deposition rate and semiconductor chip made therebyADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 11, 2001·12 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →