Inventor · disambiguated record
Niranjan Sunil Mudakatte
Also filed as: MUDAKATTE NIRANJAN SUNIL
35 granted patents·10 pending applications·92 citations·filing 2013–2018
96Inventor score
Files withQUALCOMM INC45
Top patents by PatentIndex Score
45 records- 0197US9807882B1Density-optimized module-level inductor ground structureQUALCOMM INC·Filed 2016·Granted Oct 31, 2017·21 cites·20 claims
- 0295US9893048B2Passive-on-glass (POG) device and methodQUALCOMM INC·Filed 2015·Granted Feb 13, 2018·7 cites·30 claims
- 0394US9959964B2Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 1, 2018·6 cites·25 claims
- 0491US10292269B1Inductor with metal-insulator-metal (MIM) capacitorQUALCOMM INC·Filed 2018·Granted May 14, 2019·9 cites·20 claims
- 0590US9673275B2Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuitsQUALCOMM INC·Filed 2015·Granted Jun 6, 2017·6 cites·18 claims
- 0687US10290414B2Substrate comprising an embedded inductor and a thin film magnetic coreQUALCOMM INC·Filed 2015·Granted May 14, 2019·6 cites·20 claims
- 0786US10069474B2Encapsulation of acoustic resonator devicesQUALCOMM INC·Filed 2016·Granted Sep 4, 2018·4 cites·30 claims
- 0884US9875848B2MIM capacitor and method of making the sameQUALCOMM INC·Filed 2015·Granted Jan 23, 2018·4 cites·30 claims
- 0983US10582609B2Integration of through glass via (TGV) filter and acoustic filterQUALCOMM INC·Filed 2017·Granted Mar 3, 2020·4 cites·19 claims
- 1083US10163771B2Interposer device including at least one transistor and at least one through-substrate viaQUALCOMM INC·Filed 2016·Granted Dec 25, 2018·4 cites·22 claims
- 1182US9966426B2Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 8, 2018·4 cites·20 claims
- 1281US10103135B2Backside ground plane for integrated circuitQUALCOMM INC·Filed 2016·Granted Oct 16, 2018·3 cites·19 claims
- 1380US10490621B1Close proximity tunable inductive elementsQUALCOMM INC·Filed 2018·Granted Nov 26, 2019·3 cites·10 claims
- 1477US10044390B2Glass substrate including passive-on-glass device and semiconductor dieQUALCOMM INC·Filed 2016·Granted Aug 7, 2018·2 cites·17 claims
- 1571US10498307B2Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductorQUALCOMM INC·Filed 2017·Granted Dec 3, 2019·1 cites·24 claims
- 1671US10171112B2RF multiplexer with integrated directional couplersQUALCOMM INC·Filed 2016·Granted Jan 1, 2019·2 cites·16 claims
- 1768US10038422B2Single-chip multi-frequency film bulk acoustic-wave resonatorsQUALCOMM INC·Filed 2016·Granted Jul 31, 2018·1 cites·20 claims
- 1867US10693432B2Solenoid structure with conductive pillar technologyQUALCOMM INC·Filed 2018·Granted Jun 23, 2020·1 cites·20 claims
- 1967US9780048B1Side-assembled passive devicesQUALCOMM INC·Filed 2016·Granted Oct 3, 2017·1 cites·20 claims
- 2065US9876513B2LC filter layer stacking by layer transfer to make 3D multiplexer structuresQUALCOMM INC·Filed 2016·Granted Jan 23, 2018·1 cites·24 claims
- 2164US10103116B2Open-passivation ball grid array padsQUALCOMM INC·Filed 2016·Granted Oct 16, 2018·1 cites·18 claims
- 2263US10607980B2Passive-on-glass (POG) device and methodQUALCOMM INC·Filed 2018·Granted Mar 31, 2020·0 cites·20 claims
- 2363US10074625B2Wafer level package (WLP) ball support using cavity structureQUALCOMM INC·Filed 2015·Granted Sep 11, 2018·1 cites·18 claims
- 2458US10523253B2Glass substrate including passive-on-glass device and semiconductor dieQUALCOMM INC·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 2554US10141908B2Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performanceQUALCOMM INC·Filed 2016·Granted Nov 27, 2018·0 cites·21 claims
- 2652US2016181233A1Metal-insulator-metal (mim) capacitors arranged in a pattern to reduce inductance, and related methodsQUALCOMM INC·Filed 2014·Application pending·0 cites
- 2750US10944379B2Hybrid passive-on-glass (POG) acoustic filterQUALCOMM INC·Filed 2016·Granted Mar 9, 2021·0 cites·19 claims
- 2849US10103703B2Double-sided circuitQUALCOMM INC·Filed 2016·Granted Oct 16, 2018·0 cites·20 claims
- 2949US9343399B2Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technologyQUALCOMM INC·Filed 2014·Granted May 17, 2016·0 cites·12 claims
- 3049US9343403B2Stress mitigation structure for wafer warpage reductionQUALCOMM INC·Filed 2014·Granted May 17, 2016·0 cites·10 claims
- 3148US10332671B2Solenoid inductorQUALCOMM INC·Filed 2016·Granted Jun 25, 2019·0 cites·26 claims
- 3248US10026546B2Apparatus with 3D wirewound inductor integrated within a substrateQUALCOMM INC·Filed 2016·Granted Jul 17, 2018·0 cites·28 claims
- 3347US2014327508A1Inductor tunable by a variable magnetic flux density componentQUALCOMM INC·Filed 2013·Application pending·0 cites
- 3443US10490348B2Two-dimensional structure to form an embedded three-dimensional structureQUALCOMM INC·Filed 2016·Granted Nov 26, 2019·0 cites·21 claims
- 3543US10187031B2Tunable matching networkQUALCOMM INC·Filed 2016·Granted Jan 22, 2019·0 cites·18 claims
- 3642US11024454B2High performance inductorsQUALCOMM INC·Filed 2016·Granted Jun 1, 2021·0 cites·15 claims
- 3739US10614942B2Inductors formed with through glass viasQUALCOMM INC·Filed 2018·Granted Apr 7, 2020·0 cites·20 claims
- 3838US2019035621A1Shaped circuit wafersQUALCOMM INC·Filed 2017·Application pending·0 cites
- 3937US2018061775A1LOW PROFILE PASSIVE ON GLASS (PoG) DEVICE COMPRISING A DIEQUALCOMM INC·Filed 2016·Application pending·0 cites
- 4037US2020091094A1Integrated filter technology with embedded devicesQUALCOMM INC·Filed 2018·Application pending·0 cites
- 4137US2018083588A1Electrode wrap-around capacitors for radio frequency (rf) applicationsQUALCOMM INC·Filed 2016·Application pending·0 cites
- 4237US2018077803A1Passives in thin filmQUALCOMM INC·Filed 2016·Application pending·0 cites
- 4336US2019363748A1Integrated Passive Device Transmission-Line ResonatorQUALCOMM INC·Filed 2018·Application pending·0 cites
- 4436US2018083589A1Face-to-face multiplexer circuit layoutQUALCOMM INC·Filed 2016·Application pending·0 cites
- 4535US2017084523A1On-package connectorQUALCOMM INC·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Niranjan Sunil Mudakatte files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →