Inventor · disambiguated record
Nicholas F. Pasch
Also filed as: PASCH NICHOLAS · PASCH NICHOLAS F
145 granted patents·13 pending applications·6,478 citations·filing 1984–2017
99Inventor score
Files withLSI LOGIC CORP117ELWHA LLC24ELWHA LLC A LTD LIABILITY CORP STATE DELAWARE5PASCH NICHOLAS F5ROLLTRONICS CORP2
Top patents by PatentIndex Score
158 records- 0198US5468681AProcess for interconnecting conductive substrates using an interposer having conductive plastic filled viasLSI LOGIC CORP·Filed 1994·Granted Nov 21, 1995·327 cites·5 claims
- 0297US6425117B1System and method for performing optical proximity correction on the interface between optical proximity corrected cellsLSI LOGIC CORP·Filed 1997·Granted Jul 23, 2002·393 cites·18 claims
- 0397US5682323ASystem and method for performing optical proximity correction on macrocell librariesLSI LOGIC CORP·Filed 1995·Granted Oct 28, 1997·375 cites·9 claims
- 0497US5681779AMethod of doping metal layers for electromigration resistanceLSI LOGIC CORP·Filed 1994·Granted Oct 28, 1997·542 cites·23 claims
- 0597US5489804AFlexible preformed planar structures for interposing between a chip and a substrateLSI LOGIC CORP·Filed 1993·Granted Feb 6, 1996·315 cites·13 claims
- 0695US8996951B2Error correction with non-volatile memory on an integrated circuitELWHA LLC·Filed 2012·Granted Mar 31, 2015·25 cites·37 claims
- 0795US5821624ASemiconductor device assembly techniques using preformed planar structuresLSI LOGIC CORP·Filed 1995·Granted Oct 13, 1998·184 cites·9 claims
- 0895US5624304ATechniques for assembling polishing pads for chemi-mechanical polishing of silicon wafersLSI LOGIC INC·Filed 1994·Granted Apr 29, 1997·115 cites·18 claims
- 0995US5516400ATechniques for assembling polishing pads for chemical-mechanical polishing of silicon wafersLSI LOGIC CORP·Filed 1994·Granted May 14, 1996·83 cites·7 claims
- 1095US5477086AShaped, self-aligning micro-bump structuresLSI LOGIC CORP·Filed 1993·Granted Dec 19, 1995·167 cites·18 claims
- 1195US5470801ALow dielectric constant insulation layer for integrated circuit structure and method of making sameLSI LOGIC CORP·Filed 1993·Granted Nov 28, 1995·176 cites·21 claims
- 1295US5438477ADie-attach technique for flip-chip style mounting of semiconductor diesLSI LOGIC CORP·Filed 1993·Granted Aug 1, 1995·196 cites·14 claims
- 1394US6068879AUse of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishingLSI LOGIC CORP·Filed 1997·Granted May 30, 2000·134 cites·34 claims
- 1494US5663076AAutomating photolithography in the fabrication of integrated circuitsLSI LOGIC CORP·Filed 1995·Granted Sep 2, 1997·101 cites·19 claims
- 1594US5504035AProcess for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrateLSI LOGIC CORP·Filed 1993·Granted Apr 2, 1996·144 cites·6 claims
- 1694US5310455ATechniques for assembling polishing pads for chemi-mechanical polishing of silicon wafersLSI LOGIC CORP·Filed 1992·Granted May 10, 1994·91 cites·9 claims
- 1793US9442854B2Memory circuitry including computational circuitry for performing supplemental functionsELWHA LLC A LTD LIABILITY CORP STATE DELAWARE·Filed 2013·Granted Sep 13, 2016·20 cites·22 claims
- 1893US5744399AProcess for forming low dielectric constant layers using fullerenesLSI LOGIC CORP·Filed 1995·Granted Apr 28, 1998·128 cites·13 claims
- 1993US5403228ATechniques for assembling polishing pads for silicon wafer polishingLSI LOGIC CORP·Filed 1993·Granted Apr 4, 1995·94 cites·16 claims
- 2093US5389194AMethods of cleaning semiconductor substrates after polishingLSI LOGIC CORP·Filed 1993·Granted Feb 14, 1995·156 cites·25 claims
- 2191US6499003B2Method and apparatus for application of proximity correction with unitary segmentationLSI LOGIC CORP·Filed 1998·Granted Dec 24, 2002·88 cites·13 claims
- 2290US8965288B2Cost-effective mobile connectivity protocolsELWHA LLC·Filed 2012·Granted Feb 24, 2015·11 cites·34 claims
- 2390US5347162APreformed planar structures employing embedded conductorsLSI LOGIC CORP·Filed 1993·Granted Sep 13, 1994·94 cites·20 claims
- 2489US9323499B2Random number generator functions in memoryELWHA LLC A LTD LIABILITY CORP STATE DELAWARE·Filed 2012·Granted Apr 26, 2016·12 cites·36 claims
- 2588US5780928AElectronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devicesLSI LOGIC CORP·Filed 1996·Granted Jul 14, 1998·105 cites·21 claims
- 2687US8925098B2Data security and access tracking in memoryELWHA LLC A LTD LIABILITY CORP STATE DELAWARE·Filed 2013·Granted Dec 30, 2014·10 cites·32 claims
- 2787US5864172ALow dielectric constant insulation layer for integrated circuit structure and method of making sameLSI LOGIC CORP·Filed 1996·Granted Jan 26, 1999·70 cites·9 claims
- 2887US5700715AProcess for mounting a semiconductor device to a circuit substrateLSI LOGIC CORP·Filed 1995·Granted Dec 23, 1997·95 cites·10 claims
- 2987US5558271AShaped, self-aligning micro-bump structuresLSI LOGIC CORP·Filed 1995·Granted Sep 24, 1996·81 cites·24 claims
- 3086US6383414B1Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishingLSI LOGIC CORP·Filed 2000·Granted May 7, 2002·30 cites·6 claims
- 3185US9876762B2Cost-effective mobile connectivity protocolsELWHA LLC·Filed 2012·Granted Jan 23, 2018·7 cites·28 claims
- 3285US5874327AFabricating a semiconductor device using precursor CMOS semiconductor substrate of a given configurationLSI LOGIC CORP·Filed 1996·Granted Feb 23, 1999·54 cites·19 claims
- 3384US9026719B2Intelligent monitoring for computation in memoryELWHA LLC·Filed 2012·Granted May 5, 2015·7 cites·31 claims
- 3484US5834799AOptically transmissive preformed planar structuresLSI LOGIC·Filed 1996·Granted Nov 10, 1998·75 cites·15 claims
- 3584US5436411AFabrication of substrates for multi-chip modulesLSI LOGIC CORP·Filed 1993·Granted Jul 25, 1995·76 cites·17 claims
- 3683US5055871AMethod and apparatus for enhancing illumination uniformity in wafer steppers using photochromic glass in the optical pathLSI LOGIC CORP·Filed 1989·Granted Oct 8, 1991·33 cites·30 claims
- 3781US5532516ATechniques for via formation and fillingLSI LOGIC CORPORTION·Filed 1995·Granted Jul 2, 1996·70 cites·4 claims
- 3881US5405808AFluid-filled and gas-filled semiconductor packagesLSI LOGIC CORP·Filed 1993·Granted Apr 11, 1995·64 cites·11 claims
- 3980US5721150AUse of silicon for integrated circuit device interconnection by direct writing of patterns thereinLSI LOGIC CORP·Filed 1996·Granted Feb 24, 1998·59 cites·4 claims
- 4079US6532585B1Method and apparatus for application of proximity correction with relative segmentationLSI LOGIC CORP·Filed 2000·Granted Mar 11, 2003·15 cites·35 claims
- 4179US6486056B2Process for making integrated circuit structure with thin dielectric between at least local interconnect level and first metal interconnect levelLSI LOGIC CORP·Filed 2001·Granted Nov 26, 2002·24 cites·6 claims
- 4279US5770889ASystems having advanced pre-formed planar structuresLSI LOGIC CORP·Filed 1995·Granted Jun 23, 1998·59 cites·13 claims
- 4379US5696428AApparatus and method using optical energy for specifying and quantitatively controlling chemically-reactive components of semiconductor processing plasma etching gasLSI LOGIC CORP·Filed 1995·Granted Dec 9, 1997·33 cites·13 claims
- 4479US5643830AProcess for manufacturing off-axis power branches for interior bond pad arrangementsLSI LOGIC CORP·Filed 1995·Granted Jul 1, 1997·53 cites·11 claims
- 4579US5298110ATrench planarization techniquesLSI LOGIC CORP·Filed 1992·Granted Mar 29, 1994·48 cites·9 claims
- 4678US5299730AMethod and apparatus for isolation of flux materials in flip-chip manufacturingLSI LOGIC CORP·Filed 1992·Granted Apr 5, 1994·46 cites·17 claims
- 4777US5384487AOff-axis power branches for interior bond pad arrangementsLSI LOGIC CORP·Filed 1993·Granted Jan 24, 1995·50 cites·18 claims
- 4876US6117795AUse of corrosion inhibiting compounds in post-etch cleaning processes of an integrated circuitLSI LOGIC CORP·Filed 1998·Granted Sep 12, 2000·48 cites·16 claims
- 4976US5441094ATrench planarization techniquesLSI LOGIC CORP·Filed 1994·Granted Aug 15, 1995·41 cites·9 claims
- 5075US5471091ATechniques for via formation and fillingLSI LOGIC CORP·Filed 1991·Granted Nov 28, 1995·42 cites·5 claims
Showing the top 50 of 158 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →