Inventor · disambiguated record
Nic Rossi
Also filed as: ROSSI NIC
6 granted patents·9 pending applications·25 citations·filing 2009–2013
77Inventor score
Top patents by PatentIndex Score
15 records- 0188US8455990B2Systems and methods of tamper proof packaging of a semiconductor deviceWARREN ROBERT W·Filed 2010·Granted Jun 4, 2013·11 cites·23 claims
- 0282US9029991B2Semiconductor packages with reduced solder voidingWARREN ROBERT W·Filed 2010·Granted May 12, 2015·7 cites·19 claims
- 0370US8552540B2Wafer level package with thermal pad for higher power dissipationWARREN ROBERT W·Filed 2011·Granted Oct 8, 2013·3 cites·6 claims
- 0461US8540529B2Shielded USB connector module with molded hood and LED light pipeWARREN ROBERT W·Filed 2011·Granted Sep 24, 2013·4 cites·20 claims
- 0546US2011001230A1Systems and Methods of Improved Heat Dissipation with Variable Pitch Grid Array PackagingCONEXANT SYSTEMS INC·Filed 2009·Application pending·0 cites
- 0646US2013208424A1Solid via pins for improved thermal and electrical conductivityWARREN ROBERT W·Filed 2013·Application pending·0 cites
- 0743US9142491B2Semiconductor package with corner pinsCONEXANT SYSTEMS INC·Filed 2013·Granted Sep 22, 2015·0 cites·20 claims
- 0842US9230928B2Spot plated leadframe and IC bond pad via array design for copper wireWARREN ROBERT W·Filed 2011·Granted Jan 5, 2016·0 cites·9 claims
- 0940US2013256885A1Copper Sphere Array PackageCONEXANT SYSTEMS INC·Filed 2013·Application pending·0 cites
- 1038US2013087915A1Copper Stud Bump Wafer Level PackageWARREN ROBERT W·Filed 2011·Application pending·0 cites
- 1137US2012326304A1Externally Wire Bondable Chip Scale Package in a System-in-Package ModuleWARREN ROBERT W·Filed 2011·Application pending·0 cites
- 1236US2012104591A1Systems and methods for improved heat dissipation in semiconductor packagesWARREN ROBERT W·Filed 2010·Application pending·0 cites
- 1336US2012032350A1Systems and Methods for Heat Dissipation Using Thermal ConduitsWARREN ROBERT W·Filed 2010·Application pending·0 cites
- 1436US2012241954A1Unpackaged and packaged IC stacked in a system-in-package moduleWARREN ROBERT W·Filed 2011·Application pending·0 cites
- 1536US2012188738A1Integrated led in system-in-package moduleWARREN ROBERT W·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →