Inventor · disambiguated record
Nicholas A. Rounds
Also filed as: ROUNDS NICHOLAS A · ROUNDS NICHOLAS ANDREW
6 granted patents·143 citations·filing 1980–1997
84Inventor score
Top patents by PatentIndex Score
6 records- 0189US4637904AProcess for molding a polymeric layer onto a substrateROHM & HAAS·Filed 1983·Granted Jan 20, 1987·65 cites·19 claims
- 0278US4514439ADust coverROHM & HAAS·Filed 1983·Granted Apr 30, 1985·22 cites·13 claims
- 0367USH1654HTransfer molding process for encapsulating semiconductor devicesFiled 1995·Granted Jun 3, 1997·30 cites·7 claims
- 0457US4333963ARadiation curable compositions containing β-cyanoethoxyalkyl acrylatesROHM & HAAS·Filed 1980·Granted Jun 8, 1982·18 cites·8 claims
- 0523US4535030ACoated substrateROUNDS NICHOLAS A·Filed 1984·Granted Aug 13, 1985·3 cites·18 claims
- 0622US5804126AProcess for making preforms useful for encapsulating semiconductorsAMOCO CORP·Filed 1997·Granted Sep 8, 1998·5 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →