Inventor · disambiguated record
Nien-Fang Wu
Also filed as: WU NIEN-FANG
24 granted patents·9 pending applications·54 citations·filing 2012–2025
94Inventor score
Top patents by PatentIndex Score
33 records- 0198US11742297B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·4 cites·20 claims
- 0298US11502062B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·12 cites·20 claims
- 0395US11264362B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·3 cites·15 claims
- 0495US11024605B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·11 cites·20 claims
- 0592US11056438B2Semiconductor packages and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·5 cites·20 claims
- 0691US11322477B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 0790US9245842B2Semiconductor devices having guard ring structure and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 26, 2016·10 cites·20 claims
- 0887US10312203B2Structure and formation method of chip package with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·4 cites·20 claims
- 0986US12355008B2Methods of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 1086US11705411B2Chip package with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
- 1184US2025355176A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1283US12288752B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 1383US12243681B2Programmable inductor and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1483US2025329684A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1582US11004809B2Chip package with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 1682US2025239536A1Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1781US12119328B2Methods of fabricating the same die stack structure and semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 1879US2024387440A1Manufacturing method of package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1977US2025166895A1Programmable inductor and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2076US11810897B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 2175US12015013B2Die stack structure, semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·20 claims
- 2275US2024427081A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2375US2024355782A1Integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2470US12412862B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 2570US12057439B2Integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 2662US11756731B2Programmable inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 12, 2023·0 cites·20 claims
- 2758US9343385B2Semiconductor device comprising a chip substrate, a mold, and a buffer layerTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 17, 2016·0 cites·20 claims
- 2858US2024411093A1Silicon-based optical component and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2956US10269489B2Programmable inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 23, 2019·0 cites·20 claims
- 3056US2024264388A1Package devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3152US9728477B2Method of manufacturing a semiconductor device having scribe linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 8, 2017·0 cites·20 claims
- 3251US9379067B2Semiconductor devices and methods of manufacture thereof having guard ring structureTAIWAN SEMICONDUCTOR MFG·Filed 2016·Granted Jun 28, 2016·0 cites·20 claims
- 3343US10937719B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 2, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →