Inventor · disambiguated record
Norihiro Abe
Also filed as: ABE NORIHIRO
9 granted patents·1 pending application·145 citations·filing 1986–2006
88Inventor score
Top patents by PatentIndex Score
10 records- 0168US4835042AAbsorbent memberKAO CORP·Filed 1987·Granted May 30, 1989·34 cites·4 claims
- 0266US6720077B2Resin composition, and use and method for preparing the sameHITACHI CHEMICAL CO LTD·Filed 2002·Granted Apr 13, 2004·12 cites·37 claims
- 0362US7041399B2Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepregHITACHI CHEMICAL CO LTD·Filed 2001·Granted May 9, 2006·2 cites·19 claims
- 0459US5126201AAbsorbent articleKAO CORP·Filed 1989·Granted Jun 30, 1992·23 cites·9 claims
- 0559US4714466AAbsorbent member for tamponKAO CORP·Filed 1986·Granted Dec 22, 1987·18 cites·8 claims
- 0658US7538150B2Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resinHITACHI CHEMICAL CO LTD·Filed 2005·Granted May 26, 2009·0 cites·26 claims
- 0756US7390571B2Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepregHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jun 24, 2008·0 cites·23 claims
- 0855US4850991AAbsorbent articleKAO CORP·Filed 1987·Granted Jul 25, 1989·39 cites·6 claims
- 0950US5214490ASheet dimension measurement systemRELIANCE ELECTRIC LTD·Filed 1991·Granted May 25, 1993·17 cites·2 claims
- 1047US2004076805A1Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewithFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Norihiro Abe files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →