Inventor · disambiguated record
Nobuhiko Chiwata
Also filed as: CHIWATA NOBUHIKO
10 granted patents·2 pending applications·20 citations·filing 2004–2019
82Inventor score
Top patents by PatentIndex Score
12 records- 0183US8368195B2Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chipsHITACHI METALS LTD·Filed 2010·Granted Feb 5, 2013·9 cites·6 claims
- 0272US8053908B2Semiconductor deviceHITACHI METALS LTD·Filed 2010·Granted Nov 8, 2011·4 cites·7 claims
- 0369US11484942B2Alloy powder, fe-based nanocrystalline alloy powder and magnetic coreHITACHI METALS LTD·Filed 2019·Granted Nov 1, 2022·0 cites·8 claims
- 0465US10104783B2Method for producing ceramic circuit boardHITACHI METALS LTD·Filed 2014·Granted Oct 16, 2018·2 cites·14 claims
- 0560US11170920B2Fe-based nanocrystalline alloy powder, method of producing the same, Fe-based amorphous alloy powder, and magnetic coreHITACHI METALS LTD·Filed 2018·Granted Nov 9, 2021·0 cites·9 claims
- 0655US7901782B2Solder alloy and glass bonded body using the sameHITACHI METALS LTD·Filed 2008·Granted Mar 8, 2011·0 cites·7 claims
- 0754US7744706B2Solder alloy for bonding oxide material, and solder joint using the sameHITACHI METALS LTD·Filed 2008·Granted Jun 29, 2010·0 cites·6 claims
- 0853US6911618B1Method of producing minute metal ballsHITACHI METALS LTD·Filed 2004·Granted Jun 28, 2005·5 cites·8 claims
- 0952US11545286B2Crystalline Fe-based alloy powder and method for producing sameHITACHI METALS LTD·Filed 2018·Granted Jan 3, 2023·0 cites·16 claims
- 1052US2010147926A1Method for oxide bonding using solder alloySOPHIA PRODUCT CO·Filed 2010·Application pending·0 cites
- 1148US2009208363A1Solder alloy for oxide bondingYAMADA MINORU·Filed 2006·Application pending·0 cites
- 1242US12251760B2Magnetic core powder, magnetic core and coil device using it, and method for producing magnetic core powderPROTERIAL LTD·Filed 2019·Granted Mar 18, 2025·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →