Inventor · disambiguated record
Noriaki Fujiki
Also filed as: FUJIKI NORIAKI
23 granted patents·4 pending applications·414 citations·filing 1993–2022
95Inventor score
Files withMITSUBISHI ELECTRIC CORP10RENESAS TECH CORP6MICRON TECHNOLOGY INC4NISSAN MOTOR4FUJIKI NORIAKI1
Top patents by PatentIndex Score
27 records- 0194US5736791ASemiconductor device and bonding pad structure thereforMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Apr 7, 1998·186 cites·14 claims
- 0282US5313101AInterconnection structure of semiconductor integrated circuit deviceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted May 17, 1994·63 cites·12 claims
- 0381US9002609B2Vehicle brake control systemNAKAMURA KENSUKE·Filed 2011·Granted Apr 7, 2015·6 cites·19 claims
- 0480US6283835B1Method and apparatus for manufacturing a semiconductor integrated circuitMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 4, 2001·19 cites·11 claims
- 0577US9452747B2Vehicle braking control deviceNISSAN MOTOR·Filed 2013·Granted Sep 27, 2016·4 cites·14 claims
- 0672US12125789B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 22, 2024·0 cites·16 claims
- 0770US6677682B1Multilayer interconnection structure including an alignment markRENESAS TECH CORP·Filed 2000·Granted Jan 13, 2004·16 cites·5 claims
- 0870US6339257B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 15, 2002·38 cites·4 claims
- 0968US5510653ASemiconductor device including silicon ladder resin layerMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Apr 23, 1996·38 cites·16 claims
- 1066US7423301B2Semiconductor device including fuse elements and bonding padRENESAS TECH CORP·Filed 2007·Granted Sep 9, 2008·2 cites·3 claims
- 1165US11456253B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·0 cites·7 claims
- 1261US10074275B2Scene determination device, travel assistance apparatus, and scene determination methodNISSAN MOTOR·Filed 2015·Granted Sep 11, 2018·1 cites·8 claims
- 1359US8670914B2Vehicle brake control systemFUJIKI NORIAKI·Filed 2011·Granted Mar 11, 2014·3 cites·20 claims
- 1455US11658121B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·0 cites·14 claims
- 1555US5488014AInterconnection structure of semiconductor integrated circuit device and manufacturing method thererforMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jan 30, 1996·20 cites·9 claims
- 1654US7217965B2Semiconductor device including fuse elements and bonding padRENESAS TECH CORP·Filed 2003·Granted May 15, 2007·4 cites·7 claims
- 1754US2009001508A1Semiconductor device including fuse elements and bonding padRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 1852US7335537B2Method of manufacturing semiconductor device including bonding pad and fuse elementsRENESAS TECH CORP·Filed 2007·Granted Feb 26, 2008·0 cites·3 claims
- 1950US11587870B2Apparatus comprising aluminum interconnections, memory devices comprising interconnections, and related methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 21, 2023·0 cites·29 claims
- 2050US6586838B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jul 1, 2003·4 cites·5 claims
- 2146US10509408B2Drive planning device, travel assistance apparatus, and drive planning methodNISSAN MOTOR·Filed 2015·Granted Dec 17, 2019·0 cites·8 claims
- 2246US6888258B2Semiconductor device including copper interconnect line and bonding pad, and method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted May 3, 2005·2 cites·12 claims
- 2343US6178972B1Method and apparatus for manufacturing a semiconductor integrated circuitMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jan 30, 2001·8 cites·14 claims
- 2442US10604150B2Vehicle stop position setting apparatus and methodNISSAN MOTOR·Filed 2015·Granted Mar 31, 2020·0 cites·10 claims
- 2536US2003214040A1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 2635US2004036098A1Semiconductor device including a capacitorMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 2735US2003100177A1Method of manufacturing semiconductor deviceFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Noriaki Fujiki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →