Inventor · disambiguated record
Norio Fukasawa
Also filed as: FUKASAWA NORIO
32 granted patents·6 pending applications·619 citations·filing 1996–2019
97Inventor score
Files withFUJITSU LTD20SONY CORP9FUJITSU MICROELECTRONICS LTD3FUJITSU SEMICONDUCTOR LTD2MURATA MANUFACTURING CO2
Top patents by PatentIndex Score
38 records- 0192US6881611B1Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the deviceFUJITSU LTD·Filed 2000·Granted Apr 19, 2005·85 cites·24 claims
- 0289US6455920B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 1998·Granted Sep 24, 2002·72 cites·3 claims
- 0387US6469370B1Semiconductor device and method of production of the semiconductor deviceFUJITSU LTD·Filed 2000·Granted Oct 22, 2002·54 cites·19 claims
- 0485US7586185B2Semiconductor device having a functional surfaceFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Sep 8, 2009·12 cites·11 claims
- 0585US7556985B2Method of fabricating semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Jul 7, 2009·9 cites·1 claims
- 0684US11050091B2Solid battery, manufacturing method of solid battery, battery pack, vehicle, power storage system, power tool, and electronic equipmentMURATA MANUFACTURING CO·Filed 2019·Granted Jun 29, 2021·2 cites·18 claims
- 0781US6511620B1Method of producing semiconductor devices having easy separability from a metal mold after moldingFUJITSU LTD·Filed 2000·Granted Jan 28, 2003·35 cites·7 claims
- 0880US6657282B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2002·Granted Dec 2, 2003·19 cites·15 claims
- 0980US6437432B2Semiconductor device having improved electrical characteristics and method of producing the sameFUJITSU LTD·Filed 2000·Granted Aug 20, 2002·30 cites·17 claims
- 1078US7064047B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2004·Granted Jun 20, 2006·16 cites·9 claims
- 1177US6784542B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2003·Granted Aug 31, 2004·15 cites·10 claims
- 1277US6471501B1Mold for fabricating semiconductor devicesFUJITSU LTD·Filed 1999·Granted Oct 29, 2002·53 cites·14 claims
- 1374US6507092B1Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the sameFUJITSU LTD·Filed 2000·Granted Jan 14, 2003·21 cites·9 claims
- 1473US6987054B2Method of fabricating a semiconductor device having a groove formed in a resin layerFUJITSU LTD·Filed 2002·Granted Jan 17, 2006·12 cites·10 claims
- 1572US6246249B1Semiconductor inspection apparatus and inspection method using the apparatusFUJITSU LTD·Filed 1997·Granted Jun 12, 2001·38 cites·4 claims
- 1672US5767528ASemiconductor device including pad portion for testingFUJITSU LTD·Filed 1996·Granted Jun 16, 1998·46 cites·21 claims
- 1771US6333638B1Semiconductor test apparatus and test method using the sameFUJITSU LTD·Filed 1997·Granted Dec 25, 2001·29 cites·20 claims
- 1869US8664775B2Semiconductor deviceSASAKI KENICHI·Filed 2012·Granted Mar 4, 2014·2 cites·9 claims
- 1969US8357620B2Laser annealing method and laser annealing apparatusSONY CORP·Filed 2009·Granted Jan 22, 2013·3 cites·10 claims
- 2065US6013944ASemiconductor device in which chip electrodes are connected to terminals arranged along the periphery of an insulative boardFUJITSU LTD·Filed 1997·Granted Jan 11, 2000·34 cites·15 claims
- 2161US6987614B2Optical pickup and optical disc drive deviceSONY CORP·Filed 2002·Granted Jan 17, 2006·3 cites·26 claims
- 2257US7064900B2Optical pickup device and optical disk device and optical device and composite optical elementSONY CORP·Filed 2002·Granted Jun 20, 2006·3 cites·20 claims
- 2356US6515347B1Wafer level semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2000·Granted Feb 4, 2003·7 cites·11 claims
- 2455US8980692B2Semiconductor device manufacturing methodFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Mar 17, 2015·0 cites·5 claims
- 2555US6518784B2Test method using semiconductor test apparatusFUJITSU LTD·Filed 2001·Granted Feb 11, 2003·6 cites·27 claims
- 2654US7345982B2Optical pickup device, optical disk drive, optical device and composite optical elementSONY CORP·Filed 2002·Granted Mar 18, 2008·2 cites·50 claims
- 2753US7180668B2Optical pickup device and optical disc deviceSONY CORP·Filed 2005·Granted Feb 20, 2007·0 cites·6 claims
- 2853US2009291515A1Semiconductor device and a semiconductor device manufacturing methodFUJITSU MICROELECTRONICS LTD·Filed 2009·Application pending·0 cites
- 2952US2019393505A1All-solid-state battery, electronic device, electronic card, wearable device, and electric motor vehicleMURATA MANUFACTURING CO·Filed 2019·Application pending·0 cites
- 3051US6188528B1Optical lens, and optical pickup and optical disc apparatus using such lensSONY CORP·Filed 1999·Granted Feb 13, 2001·9 cites·11 claims
- 3148US7872360B2Semiconductor device and method of manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Jan 18, 2011·0 cites·9 claims
- 3246US7616548B2Optical pickup apparatus and optical disc apparatusSONY CORP·Filed 2005·Granted Nov 10, 2009·0 cites·2 claims
- 3345US6388461B2Semiconductor inspection apparatus and inspection method using the apparatusFUJITSU LTD·Filed 2001·Granted May 14, 2002·2 cites·2 claims
- 3442US7248544B2Optical head and recording and/or reproducing apparatus employing sameSONY CORP·Filed 2004·Granted Jul 24, 2007·0 cites·30 claims
- 3538US2002030258A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFUJITSU LTD·Filed 2001·Application pending·0 cites
- 3636US2015208560A1Holding head, feeding apparatus, feeding method, implementing apparatus, implementing method, and electronic deviceSONY CORP·Filed 2015·Application pending·0 cites
- 3732US2002127776A1Semiconductor device having an organic material layer and method for making the sameFUJITSU LTD·Filed 2001·Application pending·0 cites
- 3830US2001003049A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFiled 1997·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →