Inventor · disambiguated record
Nobuaki Hashimoto
Also filed as: HASHIMOTO NOBUAKI
216 granted patents·29 pending applications·4,349 citations·filing 1986–2024
99Inventor score
Files withSEIKO EPSON CORP176HASHIMOTO NOBUAKI30ADVANCED INTERCONNECT SYSTEMS LTD9FANUC LTD7TOKYO KIKAI SEISAKUSHO LTD6
Top patents by PatentIndex Score
245 records- 0199US6545228B2Semiconductor device with a plurality of stacked boards and method of makingSEIKO EPSON CORP·Filed 2001·Granted Apr 8, 2003·201 cites·20 claims
- 0299US4727807AApparatus for automatically mounting and removing printing plates in rotary printing pressTOKYO KIKAI SEISAKUSHO LTD·Filed 1986·Granted Mar 1, 1988·170 cites·3 claims
- 0398US9496202B2Electronic substrateSEIKO EPSON CORP·Filed 2015·Granted Nov 15, 2016·26 cites·6 claims
- 0498US6667551B2Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavitySEIKO EPSON CORP·Filed 2001·Granted Dec 23, 2003·233 cites·29 claims
- 0597US6583516B2Semiconductor device and method of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2001·Granted Jun 24, 2003·99 cites·39 claims
- 0696US9070637B2Device-mounted substrate, infrared light sensor and through electrode forming methodYODA TSUYOSHI·Filed 2012·Granted Jun 30, 2015·38 cites·20 claims
- 0796US6489687B1Semiconductor device and method of manufacturing the same, manufacturing device, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2000·Granted Dec 3, 2002·133 cites·32 claims
- 0896US6462284B1Semiconductor device and method of manufacture thereofSEIKO EPSON CORP·Filed 1999·Granted Oct 8, 2002·84 cites·29 claims
- 0995US7746663B2Electronic substrate and electronic deviceSEIKO EPSON CORP·Filed 2006·Granted Jun 29, 2010·25 cites·20 claims
- 1095US6852621B2Semiconductor device and manufacturing method therefor, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2003·Granted Feb 8, 2005·82 cites·19 claims
- 1195US6483718B2Semiconductor device and method of manufacture thereof, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2001·Granted Nov 19, 2002·81 cites·20 claims
- 1295US6255737B1Semiconductor device and method of making the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 1997·Granted Jul 3, 2001·117 cites·39 claims
- 1394US8294260B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusITO HARUKI·Filed 2011·Granted Oct 23, 2012·12 cites·11 claims
- 1494US7495331B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusSEIKO EPSON CORP·Filed 2006·Granted Feb 24, 2009·16 cites·11 claims
- 1594US6867496B1Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2000·Granted Mar 15, 2005·64 cites·15 claims
- 1694US6803663B2Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit boardSEIKO EPSON CORP·Filed 2002·Granted Oct 12, 2004·52 cites·25 claims
- 1794US6744122B1Semiconductor device, method of manufacture thereof, circuit board, and electronic deviceSEIKO EPSON CORP·Filed 2000·Granted Jun 1, 2004·87 cites·6 claims
- 1894US6486544B1Semiconductor device and method manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 1999·Granted Nov 26, 2002·147 cites·10 claims
- 1994US6323542B1Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 1998·Granted Nov 27, 2001·101 cites·34 claims
- 2094US5729437AElectronic part including a thin body of molding resinSEIKO EPSON CORP·Filed 1995·Granted Mar 17, 1998·180 cites·10 claims
- 2193US7746232B2Electronic substrate, semiconductor device, and electronic deviceSEIKO EPSON CORP·Filed 2007·Granted Jun 29, 2010·18 cites·8 claims
- 2293US7564142B2Electronic device and method of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2007·Granted Jul 21, 2009·24 cites·10 claims
- 2393US6200824B1Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing deviceSEIKO EPSON CORP·Filed 1999·Granted Mar 13, 2001·41 cites·10 claims
- 2492US10636726B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2019·Granted Apr 28, 2020·3 cites·30 claims
- 2592US6670700B1Interconnect substrate and semiconductor device electronic instrumentSEIKO EPSON CORP·Filed 2000·Granted Dec 30, 2003·55 cites·38 claims
- 2692US6518651B2Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2001·Granted Feb 11, 2003·42 cites·28 claims
- 2792US6475896B1Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 1997·Granted Nov 5, 2002·85 cites·27 claims
- 2891US7888177B2Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2010·Granted Feb 15, 2011·8 cites·10 claims
- 2991US6340606B1Semiconductor device and method of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2000·Granted Jan 22, 2002·35 cites·22 claims
- 3091US6333565B1Semiconductor device and method of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 1999·Granted Dec 25, 2001·75 cites·32 claims
- 3190US7271499B2Semiconductor device and method of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2006·Granted Sep 18, 2007·12 cites·20 claims
- 3290US6608389B1Semiconductor device with stress relieving layer comprising circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2000·Granted Aug 19, 2003·41 cites·14 claims
- 3390US6507095B1Wiring board, connected board and semiconductor device, method of manufacture thereof, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2000·Granted Jan 14, 2003·47 cites·101 claims
- 3490US6328249B1Adjustable position web supply mechanism for a rotary printing pressTOKYO KIKAI SEISAKUSHO LTD·Filed 2000·Granted Dec 11, 2001·29 cites·13 claims
- 3589US7038323B2Semiconductor device and method of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted May 2, 2006·11 cites·7 claims
- 3689US6977441B2Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2004·Granted Dec 20, 2005·52 cites·6 claims
- 3789US6775153B2Semiconductor device and method of manufacture thereof, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2002·Granted Aug 10, 2004·43 cites·20 claims
- 3889US6734535B1Semiconductor device, method of manufacture thereof, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2000·Granted May 11, 2004·54 cites·15 claims
- 3989US6515370B2Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit boardSEIKO EPSON CORP·Filed 1998·Granted Feb 4, 2003·61 cites·26 claims
- 4089US6097610ASemiconductor device and method of manufacturing the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 1999·Granted Aug 1, 2000·45 cites·30 claims
- 4189US5821614ACard type semiconductor deviceSEIKO EPSON CORP·Filed 1995·Granted Oct 13, 1998·131 cites·38 claims
- 4288US9251942B2Electronic substrate, semiconductor device, and electronic deviceSEIKO EPSON CORP·Filed 2013·Granted Feb 2, 2016·5 cites·8 claims
- 4388US7470979B2Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted Dec 30, 2008·10 cites·10 claims
- 4488US6727431B2Optical module, circuit board and electronic deviceSEIKO EPSON CORP·Filed 2002·Granted Apr 27, 2004·46 cites·20 claims
- 4587US10312182B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2018·Granted Jun 4, 2019·2 cites·29 claims
- 4687US6521483B1Semiconductor device, method of manufacture thereof, circuit board, and electronic deviceSEIKO EPSON CORP·Filed 2000·Granted Feb 18, 2003·44 cites·22 claims
- 4787US6066512ASemiconductor device, method of fabricating the same, and electronic apparatusSEIKO EPSON CORP·Filed 1999·Granted May 23, 2000·49 cites·43 claims
- 4886US6175151B1Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrumentSEIKO EPSON CORP·Filed 1998·Granted Jan 16, 2001·48 cites·38 claims
- 4986US6144507AMethod of mounting a sealed assembly on a mounting substrate and optical transducerSEIKO EPSON CORP·Filed 1997·Granted Nov 7, 2000·81 cites·20 claims
- 5085US7129420B2Semiconductor device and method for manufacture thereof, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted Oct 31, 2006·11 cites·6 claims
Showing the top 50 of 245 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →