Inventor · disambiguated record
Nobuhiro Higashi
Also filed as: HIGASHI NOBUHIRO
6 granted patents·5 pending applications·1 citations·filing 2018–2023
65Inventor score
Files withFUJI ELECTRIC CO LTD11
Top patents by PatentIndex Score
11 records- 0182US12456695B2Semiconductor apparatus and manufacturing method for semiconductor apparatusFUJI ELECTRIC CO LTD·Filed 2022·Granted Oct 28, 2025·1 cites·18 claims
- 0253US2024145353A1Semiconductor module, method for manufacturing semiconductor module, semiconductor device, and vehicleFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 0350US11626333B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·16 claims
- 0450US2023223314A1Semiconductor apparatus and vehicleFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 0550US2023069967A1Semiconductor apparatus and semiconductor apparatus manufacturing methodFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 0649US2023253275A1Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 0747US11817327B2Semiconductor device and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·17 claims
- 0844US10957619B2Semiconductor apparatusFUJI ELECTRIC CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·16 claims
- 0943US11189547B2Semiconductor module and semiconductor module manufacturing methodFUJI ELECTRIC CO LTD·Filed 2019·Granted Nov 30, 2021·0 cites·13 claims
- 1037US2018337668A1Semiconductor module, switching element selecting method used for semiconductor module, and chip designing method for switching elementFUJI ELECTRIC CO LTD·Filed 2018·Application pending·0 cites
- 1132US10439606B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2018·Granted Oct 8, 2019·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →