Inventor · disambiguated record
Noriaki Higuchi
Also filed as: HIGUCHI NORIAKI
9 granted patents·5 pending applications·263 citations·filing 1988–2025
89Inventor score
Files withMITSUBISHI ELECTRIC CORP5TOPPAN HOLDINGS INC3TOPPAN PRINTING CO LTD2NISSHA PRINTING1RENESAS TECH CORP1
Top patents by PatentIndex Score
14 records- 0189US12043054B2DisplayTOPPAN INC·Filed 2023·Granted Jul 23, 2024·1 cites·17 claims
- 0288US4994224AInjection molding device and method for manufacturing a foil decorated moldingNISSHA PRINTING·Filed 1988·Granted Feb 19, 1991·78 cites·17 claims
- 0378US5994785AEpoxy resin compositions and semiconductor devices encapsulated therewithMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Nov 30, 1999·70 cites·4 claims
- 0478US5940688AEpoxy resin composition and semiconductor device encapsulated therewithSHINETSU CHEMICAL CO·Filed 1997·Granted Aug 17, 1999·57 cites·10 claims
- 0560US10493773B2Image producing device, transfer ribbon and image producing methodTOPPAN PRINTING CO LTD·Filed 2018·Granted Dec 3, 2019·0 cites·6 claims
- 0657US5645864AResin encapsulating molding die for manufacturing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jul 8, 1997·23 cites·14 claims
- 0754US2017259584A1Image producing device, transfer ribbon and image producing methodTOPPAN PRINTING CO LTD·Filed 2017·Application pending·0 cites
- 0853US6207296B1Inorganic filler, epoxy resin composition, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Mar 27, 2001·15 cites·6 claims
- 0953US2025198824A1Electrostatic capacitance detection tag and container with tagTOPPAN HOLDINGS INC·Filed 2025·Application pending·0 cites
- 1052US2025132498A1Rfid tag and antenna patternTOPPAN HOLDINGS INC·Filed 2024·Application pending·0 cites
- 1152US2025197062A1Opening detection tag and tagged containerTOPPAN HOLDINGS INC·Filed 2025·Application pending·0 cites
- 1246US5935314AInorganic filler, epoxy resin composition, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Aug 10, 1999·11 cites·6 claims
- 1336US5412157ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted May 2, 1995·8 cites·9 claims
- 1433US2004262723A1Semiconductor deviceRENESAS TECH CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →