Inventor · disambiguated record
Nobuhiro Ichiroku
Also filed as: ICHIROKU NOBUHIRO
17 granted patents·2 pending applications·176 citations·filing 1995–2019
93Inventor score
Top patents by PatentIndex Score
19 records- 0193US7026382B2Conductive resin compositionSHINETSU CHEMICAL CO·Filed 2003·Granted Apr 11, 2006·47 cites·8 claims
- 0287US7488539B2Adhesive composition and sheet having an adhesive layer of the compositionSHINETSU CHEMICAL CO·Filed 2006·Granted Feb 10, 2009·17 cites·6 claims
- 0380US7722949B2Adhesive composition and adhesive film therefromSHINETSU CHEMICAL CO·Filed 2007·Granted May 25, 2010·4 cites·6 claims
- 0478US7820742B2Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees CSHINETSU CHEMICAL CO·Filed 2007·Granted Oct 26, 2010·4 cites·11 claims
- 0577US7683152B2Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymerSHINETSU CHEMICAL CO·Filed 2005·Granted Mar 23, 2010·4 cites·5 claims
- 0676US10704008B2Heat-conductive silicone grease compositionSHINETSU CHEMICAL CO·Filed 2016·Granted Jul 7, 2020·1 cites·6 claims
- 0770US7147920B2Wafer dicing/die bonding sheetSHINETSU CHEMICAL CO·Filed 2003·Granted Dec 12, 2006·18 cites·8 claims
- 0870US6808819B2Heat resistant resin composition and adhesive filmSHINETSU CHEMICAL CO·Filed 2003·Granted Oct 26, 2004·7 cites·5 claims
- 0967US6645632B2Film-type adhesive for electronic components, and electronic components bonded therewithSHINETSU CHEMICAL CO·Filed 2001·Granted Nov 11, 2003·15 cites·9 claims
- 1065US7244495B2Dicing/die bonding adhesion tapeSHINETSU CHEMICAL CO·Filed 2004·Granted Jul 17, 2007·10 cites·9 claims
- 1165US6949619B2Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin compositionSHINETSU CHEMICAL CO·Filed 2003·Granted Sep 27, 2005·11 cites·9 claims
- 1263US6506822B2Epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2001·Granted Jan 14, 2003·12 cites·9 claims
- 1355US7364797B2Adhesive composition and adhesive filmSHINETSU CHEMICAL CO·Filed 2004·Granted Apr 29, 2008·2 cites·7 claims
- 1454US6117953ALiquid epoxy resin composition for ball grid array packageSHINETSU CHEMICAL CO·Filed 1999·Granted Sep 12, 2000·19 cites·3 claims
- 1554US2021253927A1Thermally conductive silicone composition and method for producing sameSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1649US5473091AQuaternary phosphorus compounds and their preparationSHINETSU CHEMICAL CO·Filed 1995·Granted Dec 5, 1995·4 cites·1 claims
- 1744US7060786B2Heat resistant resin composition and adhesive filmSHINETSU CHEMICAL CO·Filed 2003·Granted Jun 13, 2006·1 cites·12 claims
- 1843US2007120271A1Dicing and die bonding adhesive tapeSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 1930US8617705B2Adhesive composition and sheet for forming semiconductor wafer-protective filmICHIROKU NOBUHIRO·Filed 2011·Granted Dec 31, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →