Inventor · disambiguated record
Nobuo Igusa
Also filed as: IGUSA NOBUO
4 granted patents·107 citations·filing 1994–1997
79Inventor score
Files withFUJITSU LTD4
Top patents by PatentIndex Score
4 records- 0180US5984165AMethod of bonding a chip part to a substrate using solder bumpsFUJITSU LTD·Filed 1997·Granted Nov 16, 1999·81 cites·18 claims
- 0256US6140286ADefluxing agent cleaning method and cleaning apparatusFUJITSU LTD·Filed 1997·Granted Oct 31, 2000·9 cites·6 claims
- 0354US5695571ACleaning method using a defluxing agentFUJITSU LTD·Filed 1994·Granted Dec 9, 1997·12 cites·24 claims
- 0440US6050479ADefluxing agent cleaning method and cleaning apparatusFUJITSU LTD·Filed 1997·Granted Apr 18, 2000·5 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →