Inventor · disambiguated record
Nobuo Iwase
Also filed as: IWASE NOBUO
22 granted patents·1,018 citations·filing 1982–1999
97Inventor score
Top patents by PatentIndex Score
22 records- 0196US4970571ABump and method of manufacturing the sameTOSHIBA KK·Filed 1988·Granted Nov 13, 1990·166 cites·13 claims
- 0292US4906341AMethod of manufacturing semiconductor device and apparatus thereforTOSHIBA KK·Filed 1988·Granted Mar 6, 1990·104 cites·6 claims
- 0391US5008582AElectronic device having a cooling elementTOSHIBA KK·Filed 1990·Granted Apr 16, 1991·162 cites·4 claims
- 0483US4659611ACircuit substrate having high thermal conductivityTOSHIBA KK·Filed 1985·Granted Apr 21, 1987·64 cites·25 claims
- 0581US5909058ASemiconductor package and semiconductor mounting partTOSHIBA KK·Filed 1997·Granted Jun 1, 1999·66 cites·12 claims
- 0680US4835344AElectronic component parts and method for manufacturing the sameTOSHIBA KK·Filed 1988·Granted May 30, 1989·47 cites·15 claims
- 0779US5907187AElectronic component and electronic component connecting structureTOSHIBA KK·Filed 1995·Granted May 25, 1999·57 cites·12 claims
- 0878US6068872AVacuum-heat processing methodASAHI ENGINEERING·Filed 1999·Granted May 30, 2000·35 cites·7 claims
- 0976US5988051AVacuum-heat processing apparatusASAHI ENGINEERING·Filed 1998·Granted Nov 23, 1999·35 cites·13 claims
- 1076US4963701ACircuit boardTOSHIBA KK·Filed 1989·Granted Oct 16, 1990·45 cites·12 claims
- 1176US4772985AThick film capacitorTOSHIBA KK·Filed 1987·Granted Sep 20, 1988·24 cites·15 claims
- 1274US4584456AProduction of resistor from insulating material by local heatingTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Apr 22, 1986·18 cites·21 claims
- 1369US5453991AIntegrated circuit device with internal inspection circuitryTOSHIBA KK·Filed 1993·Granted Sep 26, 1995·49 cites·15 claims
- 1468US4412377AMethod for manufacturing a hybrid integrated circuit deviceTOKYO SHIBAURA ELECTRIC CO·Filed 1982·Granted Nov 1, 1983·29 cites·6 claims
- 1565US5412160ACircuit boardTOSHIBA KK·Filed 1994·Granted May 2, 1995·33 cites·7 claims
- 1656US5326623ACircuit boardTOSHIBA KK·Filed 1993·Granted Jul 5, 1994·23 cites·18 claims
- 1748US5041700ACircuit board including an aluminum nitride substrate and a multilayered metal oxynitride structureTOSHIBA KK·Filed 1990·Granted Aug 20, 1991·18 cites·20 claims
- 1846US5622769ACeramic circuit board having a thermal conductivity substrateTOSHIBA KK·Filed 1994·Granted Apr 22, 1997·15 cites·5 claims
- 1942US4855251AMethod of manufacturing electronic parts including transfer of bumps of larger particle sizesTOSHIBA KK·Filed 1988·Granted Aug 8, 1989·10 cites·9 claims
- 2040US4797530ACeramic circuit substrates and methods of manufacturing sameTOSHIBA KK·Filed 1986·Granted Jan 10, 1989·9 cites·44 claims
- 2133US4919731ABrazing pasteTOSHIBA KK·Filed 1989·Granted Apr 24, 1990·4 cites·9 claims
- 2233US4916261ACircuit substrate and producing method of the sameTOSHIBA KK·Filed 1984·Granted Apr 10, 1990·5 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →