Inventor · disambiguated record
Noritaka Katagiri
Also filed as: KATAGIRI NORITAKA
4 granted patents·1 pending application·82 citations·filing 2000–2014
77Inventor score
Top patents by PatentIndex Score
5 records- 0186US9485864B2Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing methodSHINKO ELECTRIC IND CO·Filed 2014·Granted Nov 1, 2016·10 cites·3 claims
- 0282US6350365B1Method of producing multilayer circuit boardSHINKO ELECTRIC IND CO·Filed 2000·Granted Feb 26, 2002·36 cites·14 claims
- 0379US6759600B2Multilayer wiring board and method of fabrication thereofSHINKO ELECTRIC IND CO·Filed 2002·Granted Jul 6, 2004·35 cites·8 claims
- 0456US9741647B2Wiring substrate, semiconductor device, and method of manufacturing wiring substrateMURAMATSU SHIGETSUGU·Filed 2011·Granted Aug 22, 2017·1 cites·12 claims
- 0535US2002083586A1Process for producing multilayer circuit boardFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →