Inventor · disambiguated record
Nobuo Kawase
Also filed as: KAWASE NOBUO
11 granted patents·1 pending application·38 citations·filing 1981–2018
87Inventor score
Top patents by PatentIndex Score
12 records- 0184US10761422B2Processing fluid supply device, substrate processing device, processing fluid supply method, substrate processing method, processing fluid processing device, and processing fluid processing methodSCREEN HOLDINGS CO LTD·Filed 2018·Granted Sep 1, 2020·3 cites·13 claims
- 0283US7579287B2Surface treatment method, manufacturing method of semiconductor device, and manufacturing method of capacitive elementCANON KK·Filed 2006·Granted Aug 25, 2009·10 cites·12 claims
- 0372US8647923B2Method of manufacturing semiconductor deviceSAKAGUCHI KIYOFUMI·Filed 2010·Granted Feb 11, 2014·5 cites·8 claims
- 0467US8871640B2Method of manufacturing semiconductor chipYONEHARA TAKAO·Filed 2010·Granted Oct 28, 2014·2 cites·4 claims
- 0567US7777848B2Manufacturing method of liquid crystal panel and deuterium oxide surface treatment method of alignment filmCANON KK·Filed 2007·Granted Aug 17, 2010·2 cites·2 claims
- 0665US10133173B2Processing fluid supply device, substrate processing device, processing fluid supply method, substrate processing method, processing fluid processing device, and processing fluid processing methodSCREEN HOLDINGS CO LTD·Filed 2013·Granted Nov 20, 2018·1 cites·42 claims
- 0761US7604928B2Patterning method and methods for producing electro-optic device, color filter, illuminant, and thin-film transistorCANON KK·Filed 2006·Granted Oct 20, 2009·1 cites·11 claims
- 0856US4382776AQuartz tube for thermal processing of semiconductor substratesFUJITSU LTD·Filed 1981·Granted May 10, 1983·13 cites·5 claims
- 0953US7961283B2Manufacturing method of liquid crystal panel and deuterium, hydrogen deuteride, or tritium treatment of alignment filmCANON KK·Filed 2010·Granted Jun 14, 2011·0 cites·4 claims
- 1048US7005081B2Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing methodCANON KK·Filed 2002·Granted Feb 28, 2006·1 cites·5 claims
- 1148US2006027531A1Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing methodKAWASE NOBUO·Filed 2005·Application pending·0 cites
- 1227US4597459AWeight detecting type sensorCANON KK·Filed 1984·Granted Jul 1, 1986·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →