Inventor · disambiguated record
Noriyuki Kinjo
Also filed as: KINJO NORIYUKI
37 granted patents·896 citations·filing 1977–2004
98Inventor score
Top patents by PatentIndex Score
37 records- 0198US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0297US4128527ADynamoelectric machine having coil windings and core encapsulated with resin-filler compositionHITACHI LTD·Filed 1977·Granted Dec 5, 1978·98 cites·17 claims
- 0386US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 0484US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 0582US4690999ALow thermal expansion resin material and composite shaped articleHITACHI LTD·Filed 1984·Granted Sep 1, 1987·45 cites·12 claims
- 0680US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 0780US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 0880US4760126AFluorine-containing polyamide-acid derivative and polyimideHITACHI LTD·Filed 1986·Granted Jul 26, 1988·26 cites·16 claims
- 0980US4642601AHumidity-sensitive elementHITACHI LTD·Filed 1981·Granted Feb 10, 1987·40 cites·33 claims
- 1079US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 1179US4473813AHumidity sensor with improved protective layeringHITACHI LTD·Filed 1982·Granted Sep 25, 1984·33 cites·17 claims
- 1279US4211686AUnsaturated polyester resin composition for use in pressure moldingHITACHI LTD·Filed 1977·Granted Jul 8, 1980·20 cites·19 claims
- 1378US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 1478US4792476ALow thermal expansion resin material and composite shaped articleHITACHI LTD·Filed 1987·Granted Dec 20, 1988·45 cites·21 claims
- 1574US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 1669US6130114ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 10, 2000·17 cites·22 claims
- 1769US6018191ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 25, 2000·18 cites·23 claims
- 1867US6531760B1Semiconductor deviceFiled 2000·Granted Mar 11, 2003·6 cites·8 claims
- 1967US5914530ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 22, 1999·15 cites·12 claims
- 2064US4886721AElectrophotographic plate by use of metal naphthalocyanine derivativeHITACHI CHEMICAL CO LTD·Filed 1988·Granted Dec 12, 1989·11 cites·13 claims
- 2163US6100580ASemiconductor device having all outer leads extending from one side of a resin memberHITACHI LTD·Filed 1998·Granted Aug 8, 2000·17 cites·19 claims
- 2263US6069029ASemiconductor device chip on lead and lead on chip manufacturingHITACHI LTD·Filed 1998·Granted May 30, 2000·13 cites·36 claims
- 2361US6072231ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 6, 2000·12 cites·40 claims
- 2460US5215842APhotosensitive element for electrophotographyHITACHI LTD·Filed 1991·Granted Jun 1, 1993·13 cites·31 claims
- 2555US4759958AMethod for forming polyimide film by chemical vapor depositionHITACHI LTD·Filed 1987·Granted Jul 26, 1988·23 cites·7 claims
- 2653US6720208B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Apr 13, 2004·2 cites·13 claims
- 2753US5219706ANaphthalocyanine derivative and production process thereof, as well as optical information recording media using the derivatives and production process thereofHITACHI CHEMICAL CO LTD·Filed 1992·Granted Jun 15, 1993·4 cites·17 claims
- 2853US5194579AFluorine-containing polyamide acid and polyamideHITACHI LTD·Filed 1990·Granted Mar 16, 1993·9 cites·9 claims
- 2951US5981315ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Nov 9, 1999·7 cites·37 claims
- 3051US5821606ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Oct 13, 1998·9 cites·45 claims
- 3150US5863817ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 26, 1999·7 cites·23 claims
- 3250US4641924ALiquid crystal deviceHITACHI LTD·Filed 1985·Granted Feb 10, 1987·15 cites·15 claims
- 3346US5021563AMetal naphthalocyanine derivative and process for producing the sameHITACHI CHEMICAL CO LTD·Filed 1989·Granted Jun 4, 1991·5 cites·10 claims
- 3444US6919622B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Jul 19, 2005·0 cites·6 claims
- 3541US6204552B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Mar 20, 2001·0 cites·15 claims
- 3637US6124629ASemiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chipHITACHI LTD·Filed 1998·Granted Sep 26, 2000·3 cites·9 claims
- 3732US6100115ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 8, 2000·1 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →